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18 Mar 2024
SERC
Institute of Microelectronics
The laser cavity electric connection line with SnAg solder for laser flip chip bonding
(Pending publish)
Ting Ta Chi,
Zhenyu Li,
Haitao Yu,
Jae Ok Yoo,
Arvind Sundaram,
Xu Feng,
Chong Ser Choong,
Wen Lee
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Patterning on reflective (Al) surface using auto alignment in immersion lithography to achieve tight overlay for reconfigurable metasurface devices
(Pending publish)
Arvind Sundaram,
Prakash Pitchappa,
Gu Zhonghua,
Jae Ok Yoo,
Navab Singh
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023
SERC
Institute of Microelectronics
A Precise Wafer Thinning Integration Process for nano-TSV Formation
Ya-Ching Tseng,
Simon Chun Kiat Goh,
Senthilkumar Darshini,
Nandini Venkataraman,
Arvind Sundaram,
Tew Chin Khang,
Yoo Jae Ok,
King-Jien Chui
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023
SERC
Institute of Microelectronics
Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission
Ting Ta Chi,
Zhenyu Li,
Nanxi Li,
Hong Cai,
Y M Tobing Landobasa,
Haitao Yu,
Senthilkumar Darshini,
Jae Ok Yoo,
Arvind Sundaram,
B.S.S. Chandra Rao,
Lennon Y. T. Lee,
Wen Lee
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023
SERC
Institute of Microelectronics
Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography
Arvind Sundaram,
Chin Khang Tew,
Guo Wei Tan,
Yuan-Hsing Fu,
Hongyu Li,
Nandini Venkataraman,
Bhesetti Chandra Rao,
Navab Singh
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
15 Mar 2023
SERC
Institute of Microelectronics
Model-based optical proximity correction for immersion lithography-based flat optics platform
Narak Choi,
Keng Heng Lai,
Arvind Sundaram,
Navab Singh,
Yuan Hsing Fu,
Lennon Yao Ting Lee
High Contrast Metastructures XII
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