Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission

Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

10.1109/ECTC51909.2023.00322

http://dx.doi.org/10.1109/ectc51909.2023.00322

Ting Ta Chi, Zhenyu Li, Nanxi Li, Hong Cai, Y M Tobing Landobasa, Haitao Yu, Senthilkumar Darshini, Jae Ok Yoo, Arvind Sundaram, B.S.S. Chandra Rao, Lennon Y. T. Lee, Wen Lee

03 August 2023

Chi, T. T., Li, Z., Li, N., Cai, H., Tobing Landobasa, Y. M., Yu, H., Darshini, S., Yoo, J. O., Sundaram, A., Rao, B. S. S. C., Lee, L. Y. T., & Lee, W. (2023, May). Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc51909.2023.00322

We report an efficient approach to integrate semiconductor laser array with photonic integrated circuits (PIC) in an optical transceiver architecture aiming for 1.6 Tbps. Key features including waveguide alignment layer, multi-tip edge coupler, pedestals, alignment marks, and under-bump metallization are used to achieve efficient integration and optical coupling.

Publisher Copyright

There was no specific funding for the research done

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https://oar.a-star.edu.sg/communities-collections/articles/20257

2377-5726

Institute of Microelectronics