Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission

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Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission
Title:
Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission
Journal Title:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
Keywords:
Publication Date:
03 August 2023
Citation:
Chi, T. T., Li, Z., Li, N., Cai, H., Tobing Landobasa, Y. M., Yu, H., Darshini, S., Yoo, J. O., Sundaram, A., Rao, B. S. S. C., Lee, L. Y. T., & Lee, W. (2023, May). Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc51909.2023.00322
Abstract:
We report an efficient approach to integrate semiconductor laser array with photonic integrated circuits (PIC) in an optical transceiver architecture aiming for 1.6 Tbps. Key features including waveguide alignment layer, multi-tip edge coupler, pedestals, alignment marks, and under-bump metallization are used to achieve efficient integration and optical coupling.
License type:
Publisher Copyright
Funding Info:
There was no specific funding for the research done
Description:
© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISSN:
2377-5726
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