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15 Jun 2024
BMRC
Singapore Institute of Food and Biotechnology Innovation
Nutritional, anti-nutrient, stability and organoleptic characterisation of plant-based milk alternatives derived from adzuki bean (Vigna angularis) and mung bean (Vigna radiata)
Dayna Shu Min Ong,
Hui Wen Lee,
Michelle Ting Yun Yeo,
Jie Hong Chiang
Future Foods
18 Mar 2024
SERC
Institute of Microelectronics
A Novel Packaging Solution for Photonic Engine Application
Xu Feng,
Li Zhenyu,
Wen Lee
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Optimization of the CMP process for direct wafer-to-wafer oxide bonding
Hong-Miao Ji,
Hemanth Kumar Cheemalamarri,
Ting-Ta Chi,
Hui-ting Lim Serene,
Wei-Jie Teo Dickson,
Siang-Kiat Neo Alfred,
Hong-Yu Li,
Gim-Guan Chen Jon,
Nandini Venkataraman,
Wen Lee
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding
Hemanth Kumar Cheemalamarri,
Ji Lir,
Wen Lee,
Vempati Srinivasa Rao,
Navab Singh
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Cu and barrier CMP process development with fine 1μm Cu bond pad and 2.5 μm pitch for Wafer-to-wafer Hybrid Bonding
Sangita Chaki Roy,
Chen Gim Guan,
Nandini Venkataraman,
Wen Lee,
Navab Singh
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
27 Oct 2023
BMRC
Singapore Institute of Food and Biotechnology Innovation
Comparative evaluation of minerals content of common green leafy vegetables consumed by the Asian populations in Singapore
Hui Wen Lee,
Xinyan BI,
Christiani Jeyakumar Henry
Journal of Food Composition and Analysis
22 Sep 2023
BMRC
Singapore Institute of Food and Biotechnology Innovation
Assessment of oxalates and phytic acid contents in Asian green leafy vegetables: Dietary recommendations
Hui Wen Lee,
Xinyan BI,
Christiani Jeyakumar Henry
Food and Humanity
3 Aug 2023
SERC
Institute of Microelectronics
Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission
Ting Ta Chi,
Zhenyu Li,
Nanxi Li,
Hong Cai,
Y M Tobing Landobasa,
Haitao Yu,
Senthilkumar Darshini,
Jae Ok Yoo,
Arvind Sundaram,
B.S.S. Chandra Rao,
Lennon Y. T. Lee,
Wen Lee
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
27 Jul 2023
SERC
Institute of Microelectronics
Laser Integration on Photonic Integrated Circuit for High Bandwidth Data Transmission
Nanxi Li,
Ting-Ta Chi,
Landobasa Y M Tobing,
Zhenyu Li,
Hong Cai,
Haitao Yu,
Yoo Jae Ok,
B.S.S. Chandra Rao,
Lennon Y. T. Lee,
Wen Lee
CLEO 2023
3 Feb 2023
BMRC
Singapore Institute of Food and Biotechnology Innovation
Is mushroom polysaccharide extract a better fat replacer than dried mushroom powder for food applications?
Cheryl Jie Yi See Toh,
Xinyan BI,
Hui Wen Lee,
Michelle Ting Yun Yeo,
Christiani Jeyakumar Henry
Frontiers in Nutrition
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