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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Optimization of the CMP process for direct wafer-to-wafer oxide bonding Hong-Miao Ji, Hemanth Kumar Cheemalamarri, Ting-Ta Chi, Hui-ting Lim Serene, Wei-Jie Teo Dickson, Siang-Kiat Neo Alfred, Hong-Yu Li, Gim-Guan Chen Jon, Nandini Venkataraman, Wen Lee 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Cu and barrier CMP process development with fine 1μm Cu bond pad and 2.5 μm pitch for Wafer-to-wafer Hybrid Bonding Sangita Chaki Roy, Chen Gim Guan, Nandini Venkataraman, Wen Lee, Navab Singh 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics A Precise Wafer Thinning Integration Process for nano-TSV Formation Ya-Ching Tseng, Simon Chun Kiat Goh, Senthilkumar Darshini, Nandini Venkataraman, Arvind Sundaram, Tew Chin Khang, Yoo Jae Ok, King-Jien Chui 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography Arvind Sundaram, Chin Khang Tew, Guo Wei Tan, Yuan-Hsing Fu, Hongyu Li, Nandini Venkataraman, Bhesetti Chandra Rao, Navab Singh 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Doping-selective etching of silicon for wafer thinning in the fabrication of backside-illuminated stacked CMOS image sensors Nandini Venkataraman, Benedikt Risse, Gregorio Decierdo, Navab Singh, Darshini Senthilkumar, Deepthi Kandasamy, Eng Huat Toh, Louis Lim 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)