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26 Jun 2024
SERC
Institute of Microelectronics
Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking
Mishra Dileep Kumar,
Vasarla Nagendra Sekhar,
B.S.S. Chandra Rao,
Ser Choong Chong,
Vempati Srinivasa Rao
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024
SERC
Institute of Microelectronics
Process Development and Integration on Si Substrate for Ion trap-based Quantum Processors
(Pending publish)
H. Y. Li,
Clarence Liu Huihong,
Norhanani Jaafar,
Morteza Ahmadi,
Mishra Dileep Kumar,
Goh Chun Kiat Simonl,
Zhou YanYan,
Manas Mukherjee,
Chui King Jien
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding
(Pending publish)
Ser Choong Chong,
Jason Au Keng Yuen,
Vasarla Nagendra Sekhar,
Ismael Cereno Daniel,
Mishra Dileep Kumar,
Vempati Srinivasa Rao
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023
SERC
Institute of Microelectronics
Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding
Vasarla Nagendra Sekhar,
Mishra Dileep Kumar,
Prayudi Lianto,
Ser Choong Chong,
Vempati Srinivasa Rao
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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