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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Process and Integration Challenges for Via Last TSV (from top) on Functional LNA SOI wafers for 3D Heterogeneous chiplet integration (Pending publish) Xiangyu Wang, Mihai Dragos Rotaru, Yu Haitao, Mingchinq Jonq, Chai Tai Chong, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Silicon Isolation Trench Integration for the 4-stack Memory Wafer Xiangyu Wang, Masaya Kawano, B.S.S. Chandra Rao 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Dielectric Materials Characterization for Hybrid Bonding Vivek Chidambaram, Prayudi Lianto, Xiangyu Wang, Gilbert See, Nicholas Wiswell, Masaya Kawano 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Passive Devices Fabrication on FOWLP and Characterization for RF Applications Chunmei Wang, King Jien Chui, Xiangyu Wang, Teck Guan Lim, Mingbin Yu, Gilbert See, Gu Yu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ) Woon Leng Loh, Xiangyu Wang, Zhaohui Chen, Mingbin Yu, King-Jien Chui 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)