Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
18 Mar 2024 | SERC | Institute of Microelectronics | Optimization of the CMP process for direct wafer-to-wafer oxide bonding | Hong-Miao Ji, Hemanth Kumar Cheemalamarri, Ting-Ta Chi, Hui-ting Lim Serene, Wei-Jie Teo Dickson, Siang-Kiat Neo Alfred, Hong-Yu Li, Gim-Guan Chen Jon, Nandini Venkataraman, Wen Lee | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
27 Jul 2023 | SERC | Institute of Microelectronics | Laser Integration on Photonic Integrated Circuit for High Bandwidth Data Transmission | Nanxi Li, Ting-Ta Chi, Landobasa Y M Tobing, Zhenyu Li, Hong Cai, Haitao Yu, Yoo Jae Ok, B.S.S. Chandra Rao, Lennon Y. T. Lee, Wen Lee | CLEO 2023 |