| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 30 May 2017 | SERC | Institute of Microelectronics | Study of C2W Bonding Using Cu Pillar with Side-wall Plated Solder | Daniel Ismael Cereno, Sunil Wickramanayaka, Vasarla Nagendra Sekhar, Ling Xie | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| 1 Sep 2013 | SERC | Institute of Microelectronics | Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices | Jaibir Sharma, Cheng Jin, Ying Ying Lim, Justin See Toh, Sanchitha Fernando, Bangtao Chen, Vasarla Nagendra Sekhar | IEEE Transactions on Components, Packaging and Manufacturing Technology |