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Publication date Communities Collections Article title Author(s) Journal/Conference
1 Oct 2024 SERC Institute of Materials Research and Engineering Design of Smart Water Meter as Groundwater Consumption Monitor Tool for Villages in Bali-Indonesia Agus Putu Abiyasa, Putu Indah Dianti Putri, Irma Suryanti, Riko I Made 2024 10th International Conference on Smart Computing and Communication (ICSCC)
24 Oct 2023 SERC Institute for Infocomm Research LiteFormer: A Lightweight and Efficient Transformer for Rotating Machine Fault Diagnosis Wenjun Sun, Ruqiang Yan, Ruibing Jin, Jiawen Xu, Yuan Yang, Zhenghua Chen IEEE Transactions on Reliability
22 Aug 2023 SERC Institute for Infocomm Research Privacy-preserving outsourcing decision tree evaluation from homomorphic encryption Kexin Xu, Benjamin Hong Meng Tan, Li-Ping Wang, Khin Mi Mi Aung, Huaxiong Wang Journal of Information Security and Applications
28 Jun 2023 SERC Institute for Infocomm Research Label-Consistent Generalizable Hash Codes Furen Zhuang, Pierre Moulin IEEE Transactions on Information Forensics and Security
19 Jun 2023 SERC Institute for Infocomm Research Generalized domain adaptation framework for parametric back-end in speaker recognition Qiongqiong Wang, Koji Okabe, Kong Aik Lee, Takafumi Koshinaka IEEE Transactions on Information Forensics and Security
10 Feb 2023 SERC Institute for Infocomm Research Categorical Inference Poisoning: Verifiable Defense Against Black-Box DNN Model Stealing Without Constraining Surrogate Data and Query Times Haitian Zhang, Guang Hua, Xinya Wang, Hao Jiang, Wen Yang IEEE Transactions on Information Forensics and Security
19 Jan 2022 SERC Institute of High Performance Computing  Reduced order models for uncertainty quantification of gas plumes from leakages during LNG bunkering Vinh-Tan Nguyen, Venugopalan S.G. Raghavan, Raymond Y.L. Quek, Lim Boon How, Deguang Yan Journal of Loss Prevention in the Process Industries
10 Aug 2021 SERC Institute of Microelectronics Heterogeneous Integration with Embedded Fine Interconnect Chai Tai Chong, Lim Teck Guan, David Ho, Han Yong, Chong Ser Choong, Sharon Lim Pei Siang, Surya Bhattacharya 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
14 Nov 2020 SERC Advanced Remanufacturing and Technology Centre  Low-cost contactless monitoring of aseptic package integrity and content quality using capacitance HARI KRISHNA SALILA VIJAYALAL MOHAN, ANDREW ALEXANDER MALCOLM, Fang Cheng Food Packaging and Shelf Life