Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Assembly process characterization of 3D Stacking of Heterogeneous Chiplets (Pending publish) Sharon Pei Siang Lim, Boon Long Lau, Tai Chong Chai, Yong Liang Ye 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Addressing the assembly challenges of Antenna-in-package Sharon Pei Siang Lim, Ser Choong Chong, David Ho Soon Wee, Wen Wei Seit, Jacob Jordan Soh, Tai Chong Chai 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Comprehensive study on Chip to wafer hybrid bonding process for fine pitch high density heterogeneous applications Sharon Pei Siang Lim, Ser Choong Chong, Vivek Chidambaram 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)