| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Comprehensive Study on Thermal Aging and Ball Shear Characterization of SAC-X Solders | Norhanani Binte Jaafar, Chong Ser Choong, Sharon Lim Pei Siang, Chai Tai Chong | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| 10 Aug 2021 | SERC | Institute of Microelectronics | Heterogeneous Integration with Embedded Fine Interconnect | Chai Tai Chong, Lim Teck Guan, David Ho, Han Yong, Chong Ser Choong, Sharon Lim Pei Siang, Surya Bhattacharya | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |