| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 10 Aug 2021 | SERC | Institute of Microelectronics | Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) | Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| 23 Jun 2021 | SERC | Institute of Materials Research and Engineering | N95 respirator decontamination: a study in reusability | Chen-Gang Wang, Zibiao Li, Songlin Liu, Cheng Teng Ng, Mardiana Marzuki, Pei Sze Jeslyn Wong, Bernice Tan, Andrea Lee, C .F. Hui Lim, Pablo Bifani, Zhanxiong Fang, Judith Chui Ching Wong, Yin Xiang Setoh, Yi Yan Yang, Cheok Hong Mun, Soo Zeng Fiona Phua, Wei Qi Lim, Longyi Lin, Alex R. Cook, Hendrix Tanoto, Lee-Ching Ng, Amit Singhal, Yew Wei Leong, Xian Jun Loh | Materials Today Advances |