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5 Jan 2022
SERC
Institute of Microelectronics
Numerical investigation of the optimization on manifold microchannel heat sink towards the water-cooling limit
Haoran Chen,
Yong Han,
Gongyue Tang
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Nonlinear Thermal Stress/Strain Analyses of Through SiC Via
C.L. Alan Lee,
Xiaowu Zhang,
Haoran Chen
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021
SERC
Institute of Microelectronics
Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP)
Xiaowu Zhang,
Boon Long Lau,
Yong Han,
Haoran Chen,
Ming Chinq Jong,
Sharon Pei Siang Lim,
Simon Siak Boon Lim,
Xiaobai Wang,
Yosephine Andriani,
Songlin Liu
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
3 May 2021
SERC
Institute of Microelectronics
A hybrid data-driven simultaneous fault diagnosis model for air handling units
Bingjie Wu,
Wenjian Cai,
Haoran Chen,
Xin Zhang
Energy and Buildings
13 Apr 2020
SERC
Institute of Microelectronics
A Dynamic Control System for Server Processor Direct Liquid Cooling
Haoran Chen,
Yong Han,
Gongyue Tang,
Xiaowu Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology
8 Aug 2019
SERC
Institute of Microelectronics
Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling
Yong Han,
Boon Long Lau,
Gongyue Tang,
Haoran Chen,
Xiaowu Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology
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