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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Transient Thermal Characterization and Analysis for Next Generation SiC Power Module Gongyue Tang, Yong Liang Ye, Leong Ching Wai, Yong Han 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics Thermal Characterization and Management of GaN-on-SiC High Power Amplifier MMIC Yong Han, Gongyue Tang, Boon Long Lau 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
20 Mar 2023 SERC Institute of Materials Research & Engineering Compositionally tuned hybridization of n-type Ag0 : Ag2Se under ambient conditions towards excellent thermoelectric properties at room temperature Si Yin Tee, Daniel Ponsford, Xian Yi Tan, Xiaobai Wang, Chee Leng Lay, Coryl Jing Jun Lee, Xi Ping Ni, Debbie Hwee Leng Seng, Warintorn Thitsartarn, Guijian Guan, Ming-Yong Han Materials Chemistry Frontiers
26 Oct 2022 SERC Institute of Materials Research & Engineering Thermoelectric Silver‐Based Chalcogenides Si Yin Tee, Daniel Ponsford, Chee Leng Lay, Xiaobai Wang, Xizu Wang, Darren Chi Jin Neo, Tianze Wu, Warintorn Thitsartarn, Jayven Chee Chuan Yeo, Guijian Guan, Tung‐Chun Lee, Ming‐Yong Han Advanced Science
5 Jan 2022 SERC Institute of Microelectronics Numerical investigation of the optimization on manifold microchannel heat sink towards the water-cooling limit Haoran Chen, Yong Han, Gongyue Tang 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Thermal Effect Investigation of Chip-to-Wafer Hybrid Bonding on 3D-Stacked Memory Yong Han, Masaya Kawano 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics AiP Component and Board Level Heat dissipation Analysis for Automotive Radar Yong Han, Tai Chong Chai, Sharon Seow Huang Lim 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
13 Apr 2020 SERC Institute of Microelectronics A Dynamic Control System for Server Processor Direct Liquid Cooling Haoran Chen, Yong Han, Gongyue Tang, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
8 Aug 2019 SERC Institute of Microelectronics Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling Yong Han, Boon Long Lau, Gongyue Tang, Haoran Chen, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology