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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Thermal Effect Investigation of Chip-to-Wafer Hybrid Bonding on 3D-Stacked Memory Yong Han, Masaya Kawano 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Numerical investigation of the optimization on manifold microchannel heat sink towards the water-cooling limit Haoran Chen, Yong Han, Gongyue Tang 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics AiP Component and Board Level Heat dissipation Analysis for Automotive Radar Yong Han, Tai Chong Chai, Sharon Seow Huang Lim 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
13 Apr 2020 SERC Institute of Microelectronics A Dynamic Control System for Server Processor Direct Liquid Cooling Haoran Chen, Yong Han, Gongyue Tang, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
8 Aug 2019 SERC Institute of Microelectronics Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling Yong Han, Boon Long Lau, Gongyue Tang, Haoran Chen, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
11 Jun 2018 SERC Institute of Materials Research and Engineering Tailoring Porosity in Copper-Based Multinary Sulfide Nanostructures for Energy, Biomedical, Catalytic, and Sensing Applications Michelle D. Regulacio, Yong Wang, Zhi Wei Seh, Ming-Yong Han ACS Applied Nano Materials
1 Nov 2017 SERC Institute of Microelectronics Study on Low Warpage and High Reliability for Large Package Using TSV-Free Interposer Technology Through SMART Codesign Modeling Mian Zhi Ding, Yong Han, Surya Bhattacharya, Fa Xing Che, Masaya Kawano IEEE Transactions on Components, Packaging and Manufacturing Technology
30 May 2017 SERC Institute of Microelectronics Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems Yong Han, Boon Long Lau, Gongyue Tang, Seow Meng Low, Jason Goh 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Jan 2017 SERC Institute of Microelectronics Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang, Min Woo Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology