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18 Mar 2024
SERC
Institute of Microelectronics
Transient Thermal Characterization and Analysis for Next Generation SiC Power Module
Gongyue Tang,
Yong Liang Ye,
Leong Ching Wai,
Yong Han
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023
SERC
Institute of Microelectronics
Thermal Characterization and Management of GaN-on-SiC High Power Amplifier MMIC
Yong Han,
Gongyue Tang,
Boon Long Lau
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
20 Mar 2023
SERC
Institute of Materials Research & Engineering
Compositionally tuned hybridization of n-type Ag0 : Ag2Se under ambient conditions towards excellent thermoelectric properties at room temperature
Si Yin Tee,
Daniel Ponsford,
Xian Yi Tan,
Xiaobai Wang,
Chee Leng Lay,
Coryl Jing Jun Lee,
Xi Ping Ni,
Debbie Hwee Leng Seng,
Warintorn Thitsartarn,
Guijian Guan,
Ming-Yong Han
Materials Chemistry Frontiers
26 Oct 2022
SERC
Institute of Materials Research & Engineering
Thermoelectric Silver‐Based Chalcogenides
Si Yin Tee,
Daniel Ponsford,
Chee Leng Lay,
Xiaobai Wang,
Xizu Wang,
Darren Chi Jin Neo,
Tianze Wu,
Warintorn Thitsartarn,
Jayven Chee Chuan Yeo,
Guijian Guan,
Tung‐Chun Lee,
Ming‐Yong Han
Advanced Science
5 Jan 2022
SERC
Institute of Microelectronics
Numerical investigation of the optimization on manifold microchannel heat sink towards the water-cooling limit
Haoran Chen,
Yong Han,
Gongyue Tang
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Thermal Effect Investigation of Chip-to-Wafer Hybrid Bonding on 3D-Stacked Memory
Yong Han,
Masaya Kawano
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021
SERC
Institute of Microelectronics
AiP Component and Board Level Heat dissipation Analysis for Automotive Radar
Yong Han,
Tai Chong Chai,
Sharon Seow Huang Lim
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP)
Xiaowu Zhang,
Boon Long Lau,
Yong Han,
Haoran Chen,
Ming Chinq Jong,
Sharon Pei Siang Lim,
Simon Siak Boon Lim,
Xiaobai Wang,
Yosephine Andriani,
Songlin Liu
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
13 Apr 2020
SERC
Institute of Microelectronics
A Dynamic Control System for Server Processor Direct Liquid Cooling
Haoran Chen,
Yong Han,
Gongyue Tang,
Xiaowu Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology
8 Aug 2019
SERC
Institute of Microelectronics
Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling
Yong Han,
Boon Long Lau,
Gongyue Tang,
Haoran Chen,
Xiaowu Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology
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