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5 Jan 2022
SERC
Institute of Microelectronics
Numerical investigation of the optimization on manifold microchannel heat sink towards the water-cooling limit
Haoran Chen,
Yong Han,
Gongyue Tang
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Thermal Effect Investigation of Chip-to-Wafer Hybrid Bonding on 3D-Stacked Memory
Yong Han,
Masaya Kawano
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021
SERC
Institute of Microelectronics
AiP Component and Board Level Heat dissipation Analysis for Automotive Radar
Yong Han,
Tai Chong Chai,
Sharon Seow Huang Lim
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP)
Xiaowu Zhang,
Boon Long Lau,
Yong Han,
Haoran Chen,
Ming Chinq Jong,
Sharon Pei Siang Lim,
Simon Siak Boon Lim,
Xiaobai Wang,
Yosephine Andriani,
Songlin Liu
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
13 Apr 2020
SERC
Institute of Microelectronics
A Dynamic Control System for Server Processor Direct Liquid Cooling
Haoran Chen,
Yong Han,
Gongyue Tang,
Xiaowu Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology
8 Aug 2019
SERC
Institute of Microelectronics
Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling
Yong Han,
Boon Long Lau,
Gongyue Tang,
Haoran Chen,
Xiaowu Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology
11 Jun 2018
SERC
Institute of Materials Research and Engineering
Tailoring Porosity in Copper-Based Multinary Sulfide Nanostructures for Energy, Biomedical, Catalytic, and Sensing Applications
Michelle D. Regulacio,
Yong Wang,
Zhi Wei Seh,
Ming-Yong Han
ACS Applied Nano Materials
1 Nov 2017
SERC
Institute of Microelectronics
Study on Low Warpage and High Reliability for Large Package Using TSV-Free Interposer Technology Through SMART Codesign Modeling
Mian Zhi Ding,
Yong Han,
Surya Bhattacharya,
Fa Xing Che,
Masaya Kawano
IEEE Transactions on Components, Packaging and Manufacturing Technology
30 May 2017
SERC
Institute of Microelectronics
Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems
Yong Han,
Boon Long Lau,
Gongyue Tang,
Seow Meng Low,
Jason Goh
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Jan 2017
SERC
Institute of Microelectronics
Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling
Yong Han,
Boon Long Lau,
Gongyue Tang,
Xiaowu Zhang,
Min Woo Rhee
IEEE Transactions on Components, Packaging and Manufacturing Technology
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