| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 10 Aug 2021 | SERC | Institute of Microelectronics | Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) | Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| 10 Aug 2021 | SERC | Institute of Microelectronics | Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio | Ser Choong Chong, Simon Siak Boon Lim, Wen Wei Seit, Tai Chong Chai, Debbie Claire Sanchez | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |