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Publication date Communities Collections Article title Author(s) Journal/Conference
5 May 2022 SERC Institute for Infocomm Research Review—"Knees" in Lithium-Ion Battery Aging Trajectories Peter M Attia, Alexander Allen Bills, Ferran Brosa Planella, Philipp Dechent, Goncalo dos Reis, Matthieu Dubarry, Paul Gasper, Richard Gilchrist, Samuel Greenbank, David Howey, Ouyang Liu, Edwin Khoo, Yuliya Preger, ABHISHEK SONI, Shashank Sripad, Anna Stefanopoulou, Valentin Sulzer Journal of The Electrochemical Society
5 Jan 2022 SERC Institute of Microelectronics Realization of High Aspect Ratio Through Mold Interconnect (TMI) using Vertical Wire Leong Ching Wai, David Ho Soon Wee, Chong Ser Choong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Low Temperature Physical Vapour Deposited Cu Seed Layer for Temporary Bonded Wafer Substrates Abdul Hannan Yeo, Serine Soh Siew Boon, David Ho Soon Wee, Kalyn Lim Tien Shee, Wei Jun Qi, Zhang Kang, Kelvin Boh Tai Ming, Cheng Ting 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
11 Oct 2021 SERC Institute for Infocomm Research A Minimal Information Set To Enable Verifiable Theoretical Battery Research Aashutosh Mistry, Ankit Verma, Shashank Sripad, Rebecca Ciez, Valentin Sulzer, Ferran Brosa Planella, Robert Timms, Yumin Zhang, Rachel Kurchin, Philipp Dechent, Weihan Li, Samuel Greenbank, Zeeshan Ahmad, Dilip Krishnamurthy, Alexis M. Fenton, Kevin Tenny, Prehit Patel, Daniel Juarez Robles, Paul Gasper, Andrew Colclasure, Artem Baskin, Corinne D. Scown, Venkat R. Subramanian, Edwin Khoo, Srikanth Allu, David Howey, Steven DeCaluwe, Scott A. Roberts, Venkatasubramanian Viswanathan ACS Energy Letters
10 Aug 2021 SERC Institute of Microelectronics Heterogeneous Integration with Embedded Fine Interconnect Chai Tai Chong, Lim Teck Guan, David Ho, Han Yong, Chong Ser Choong, Sharon Lim Pei Siang, Surya Bhattacharya 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics FOWLP and Si-Interposer for High-Speed Photonic Packaging Lim Teck Guan, Eva Wai Leong Ching, Jong Ming Ching, Loh Woon Leng, David Ho Soon Wee, Surya Bhattacharya 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute for Infocomm Research, Institute of Microelectronics Automated Attribute Measurements of Buried Package Features in 3D X-ray Images using Deep Learning Ramanpreet Singh Pahwa, Ma Tin Lay Nwe, Richard Chang, Oo Zaw Min, Wang Jie, Saisubramaniam Gopalakrishnan, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao, Haiwen Dai, Jens Timo Neumann, Ramani Pichumani, Tom Gregorich 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute for Infocomm Research, Institute of Microelectronics Automated Void Detection in TSVs from 2D X-Ray Scans using Supervised Learning with 3D X-Ray Scans Ramanpreet Singh Pahwa, Saisubramaniam Gopalakrishnan, Huang Su, Ong Ee Ping, Haiwen Dai, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 Dec 2020 SERC Institute for Infocomm Research MACHINE-LEARNING BASED METHODOLOGIES FOR 3D X-RAY MEASUREMENT, CHARACTERIZATION AND OPTIMIZATION FOR BURIED STRUCTURES IN ADVANCED IC PACKAGES Ramanpreet Singh Pahwa, Tin Lay Nwe, Richard Chang, Zaw Min, Wang Jie, Tom Gregorich, David Ho, Vempati Srinivasa Rao International Wafer Level Packaging Conference (IWLPC)
30 May 2017 SERC Institute of Microelectronics Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package Sharon PS Lim, Daniel Ismael, Ye Yong Liang, Vempati Srinivasa Rao, Chai Tai Chong, David Ho, Ding Mian Zhi, Chong Ser Choong 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
23 Jun 2015 SERC Institute of Microelectronics Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong Applied Physics Reviews
1 Aug 2013 SERC Institute of Microelectronics Development of Package-on-Package Using Embedded Wafer-Level Package Approach (Pending publish) Ser Choong Chong, David Ho Soon Wee, Vempati Srinivasa Rao, Nagendra Sekhar Vasarla IEEE Transactions on Components, Packaging and Manufacturing Technology