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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Through Mold Vertical Interconnect Formation in FOWLP using conductive paste (Pending publish) Serine Soh Siew Boon, Soon Wee David Ho, Norhanani Jaafar 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples Dominico Giusti, Alex Gritti, Fabio Quaglia, Alessandro Stuart Savoia, Hideyuki Sandoh, Gerald Klug, Hitoshi Hoshino, Dutta Rahul, Vempati Srinivasa Rao, David Ho Soon Wee, Masatoshi Wakahara, Mark Shaw 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics 3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer Chai Tai Chong, Lau Boon Long, Sharon Lim Pei Siang, David Ho Soon Wee, Rob van Kampen, Paul Castillou, Roberto Gaddi, Lance Barron, Mickael Renault, Jay Ko, Jonathan Hammond 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 May 2022 SERC Institute for Infocomm Research Review—"Knees" in Lithium-Ion Battery Aging Trajectories Peter M Attia, Alexander Allen Bills, Ferran Brosa Planella, Philipp Dechent, Goncalo dos Reis, Matthieu Dubarry, Paul Gasper, Richard Gilchrist, Samuel Greenbank, David Howey, Ouyang Liu, Edwin Khoo, Yuliya Preger, ABHISHEK SONI, Shashank Sripad, Anna Stefanopoulou, Valentin Sulzer Journal of The Electrochemical Society
5 Jan 2022 SERC Institute of Microelectronics Heterogeneous Integration on Fan-Out Wafer Level Packaging Platform Tc Chai, David Ho, Sc Chong, Ps Sharon Lim, Hy Hsiao, Jacob Soh 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Addressing the assembly challenges of Antenna-in-package Sharon Pei Siang Lim, Ser Choong Chong, David Ho Soon Wee, Wen Wei Seit, Jacob Jordan Soh, Tai Chong Chai 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging Lau Boon Long, David Ho, Lim Teck Guan, Hsiao Hsiang Yao, Lim Pei Siang, Norhanani Jaafar 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Low Temperature Physical Vapour Deposited Cu Seed Layer for Temporary Bonded Wafer Substrates Abdul Hannan Yeo, Serine Soh Siew Boon, David Ho Soon Wee, Kalyn Lim Tien Shee, Wei Jun Qi, Zhang Kang, Kelvin Boh Tai Ming, Cheng Ting 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Realization of High Aspect Ratio Through Mold Interconnect (TMI) using Vertical Wire Leong Ching Wai, David Ho Soon Wee, Chong Ser Choong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
11 Oct 2021 SERC Institute for Infocomm Research A Minimal Information Set To Enable Verifiable Theoretical Battery Research Aashutosh Mistry, Ankit Verma, Shashank Sripad, Rebecca Ciez, Valentin Sulzer, Ferran Brosa Planella, Robert Timms, Yumin Zhang, Rachel Kurchin, Philipp Dechent, Weihan Li, Samuel Greenbank, Zeeshan Ahmad, Dilip Krishnamurthy, Alexis M. Fenton, Kevin Tenny, Prehit Patel, Daniel Juarez Robles, Paul Gasper, Andrew Colclasure, Artem Baskin, Corinne D. Scown, Venkat R. Subramanian, Edwin Khoo, Srikanth Allu, David Howey, Steven DeCaluwe, Scott A. Roberts, Venkatasubramanian Viswanathan ACS Energy Letters