New Submission
Communities & Collections
FAQ
Login
Find journal articles, conference proceedings and datasets deposited in A*OAR
Collection
Please select a collection
Author
Topic
Funding info
Date published
Search
Clear
Search
Clear
Collapse
Home
Search
Search results
Publication date
Communities
Collections
Article title
Author(s)
Journal/Conference
5 May 2022
SERC
Institute for Infocomm Research
Review—"Knees" in Lithium-Ion Battery Aging Trajectories
Peter M Attia,
Alexander Allen Bills,
Ferran Brosa Planella,
Philipp Dechent,
Goncalo dos Reis,
Matthieu Dubarry,
Paul Gasper,
Richard Gilchrist,
Samuel Greenbank,
David Howey,
Ouyang Liu,
Edwin Khoo,
Yuliya Preger,
ABHISHEK SONI,
Shashank Sripad,
Anna Stefanopoulou,
Valentin Sulzer
Journal of The Electrochemical Society
5 Jan 2022
SERC
Institute of Microelectronics
Heterogeneous Integration on Fan-Out Wafer Level Packaging Platform
Tc Chai,
David Ho,
Sc Chong,
Ps Sharon Lim,
Hy Hsiao,
Jacob Soh
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Addressing the assembly challenges of Antenna-in-package
Sharon Pei Siang Lim,
Ser Choong Chong,
David Ho Soon Wee,
Wen Wei Seit,
Jacob Jordan Soh,
Tai Chong Chai
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging
Lau Boon Long,
David Ho,
Lim Teck Guan,
Hsiao Hsiang Yao,
Lim Pei Siang,
Norhanani Jaafar
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Low Temperature Physical Vapour Deposited Cu Seed Layer for Temporary Bonded Wafer Substrates
Abdul Hannan Yeo,
Serine Soh Siew Boon,
David Ho Soon Wee,
Kalyn Lim Tien Shee,
Wei Jun Qi,
Zhang Kang,
Kelvin Boh Tai Ming,
Cheng Ting
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Realization of High Aspect Ratio Through Mold Interconnect (TMI) using Vertical Wire
Leong Ching Wai,
David Ho Soon Wee,
Chong Ser Choong
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
11 Oct 2021
SERC
Institute for Infocomm Research
A Minimal Information Set To Enable Verifiable Theoretical Battery Research
Aashutosh Mistry,
Ankit Verma,
Shashank Sripad,
Rebecca Ciez,
Valentin Sulzer,
Ferran Brosa Planella,
Robert Timms,
Yumin Zhang,
Rachel Kurchin,
Philipp Dechent,
Weihan Li,
Samuel Greenbank,
Zeeshan Ahmad,
Dilip Krishnamurthy,
Alexis M. Fenton,
Kevin Tenny,
Prehit Patel,
Daniel Juarez Robles,
Paul Gasper,
Andrew Colclasure,
Artem Baskin,
Corinne D. Scown,
Venkat R. Subramanian,
Edwin Khoo,
Srikanth Allu,
David Howey,
Steven DeCaluwe,
Scott A. Roberts,
Venkatasubramanian Viswanathan
ACS Energy Letters
10 Aug 2021
SERC
Institute of Microelectronics
FOWLP and Si-Interposer for High-Speed Photonic Packaging
Lim Teck Guan,
Eva Wai Leong Ching,
Jong Ming Ching,
Loh Woon Leng,
David Ho Soon Wee,
Surya Bhattacharya
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
Heterogeneous Integration with Embedded Fine Interconnect
Chai Tai Chong,
Lim Teck Guan,
David Ho,
Han Yong,
Chong Ser Choong,
Sharon Lim Pei Siang,
Surya Bhattacharya
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute for Infocomm Research,
Institute of Microelectronics
Automated Void Detection in TSVs from 2D X-Ray Scans using Supervised Learning with 3D X-Ray Scans
Ramanpreet Singh Pahwa,
Saisubramaniam Gopalakrishnan,
Huang Su,
Ong Ee Ping,
Haiwen Dai,
David Ho Soon Wee,
Ren Qin,
Vempati Srinivasa Rao
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1
2
items per page
10
25
50
100