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Publication date Communities Collections Article title Author(s) Journal/Conference
10 Aug 2021 SERC Institute for Infocomm Research Automated Attribute Measurements of Buried Package Features in 3D X-ray Images using Deep Learning (Pending publish) Ramanpreet Singh Pahwa, Ma Tin Lay Nwe, Richard Chang, Oo Zaw Min, Wang Jie, Saisubramaniam Gopalakrishnan, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao, Haiwen Dai, Jens Timo Neumann, Ramani Pichumani, Tom Gregorich 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute for Infocomm Research Automated Void Detection in TSVs from 2D X-Ray Scans using Supervised Learning with 3D X-Ray Scans (Pending publish) Ramanpreet Singh Pahwa, Saisubramaniam Gopalakrishnan, Huang Su, Ong Ee Ping, Haiwen Dai, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 Dec 2020 SERC Institute for Infocomm Research MACHINE-LEARNING BASED METHODOLOGIES FOR 3D X-RAY MEASUREMENT, CHARACTERIZATION AND OPTIMIZATION FOR BURIED STRUCTURES IN ADVANCED IC PACKAGES Ramanpreet Singh Pahwa, Tin Lay Nwe, Richard Chang, Zaw Min, Wang Jie, Tom Gregorich, David Ho, Vempati Srinivasa Rao International Wafer Level Packaging Conference (IWLPC)
30 May 2017 SERC Institute of Microelectronics Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package Sharon PS Lim, Daniel Ismael, Ye Yong Liang, Vempati Srinivasa Rao, Chai Tai Chong, David Ho, Ding Mian Zhi, Chong Ser Choong 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
23 Jun 2015 SERC Institute of Microelectronics Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong Applied Physics Reviews
1 Aug 2013 SERC Institute of Microelectronics Development of Package-on-Package Using Embedded Wafer-Level Package Approach (Pending publish) Ser Choong Chong, David Ho Soon Wee, Vempati Srinivasa Rao, Nagendra Sekhar Vasarla IEEE Transactions on Components, Packaging and Manufacturing Technology