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18 Mar 2024
SERC
Institute of Microelectronics
Through Mold Vertical Interconnect Formation in FOWLP using conductive paste
Serine Soh Siew Boon,
Soon Wee David Ho,
Norhanani Jaafar
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023
SERC
Institute of Microelectronics
Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples
Dominico Giusti,
Alex Gritti,
Fabio Quaglia,
Alessandro Stuart Savoia,
Hideyuki Sandoh,
Gerald Klug,
Hitoshi Hoshino,
Dutta Rahul,
Vempati Srinivasa Rao,
David Ho Soon Wee,
Masatoshi Wakahara,
Mark Shaw
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023
SERC
Institute of Microelectronics
3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer
Chai Tai Chong,
Lau Boon Long,
Sharon Lim Pei Siang,
David Ho Soon Wee,
Rob van Kampen,
Paul Castillou,
Roberto Gaddi,
Lance Barron,
Mickael Renault,
Jay Ko,
Jonathan Hammond
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 May 2022
SERC
Institute for Infocomm Research
Review—"Knees" in Lithium-Ion Battery Aging Trajectories
Peter M Attia,
Alexander Allen Bills,
Ferran Brosa Planella,
Philipp Dechent,
Goncalo dos Reis,
Matthieu Dubarry,
Paul Gasper,
Richard Gilchrist,
Samuel Greenbank,
David Howey,
Ouyang Liu,
Edwin Khoo,
Yuliya Preger,
ABHISHEK SONI,
Shashank Sripad,
Anna Stefanopoulou,
Valentin Sulzer
Journal of The Electrochemical Society
5 Jan 2022
SERC
Institute of Microelectronics
Heterogeneous Integration on Fan-Out Wafer Level Packaging Platform
Tc Chai,
David Ho,
Sc Chong,
Ps Sharon Lim,
Hy Hsiao,
Jacob Soh
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Addressing the assembly challenges of Antenna-in-package
Sharon Pei Siang Lim,
Ser Choong Chong,
David Ho Soon Wee,
Wen Wei Seit,
Jacob Jordan Soh,
Tai Chong Chai
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging
Lau Boon Long,
David Ho,
Lim Teck Guan,
Hsiao Hsiang Yao,
Lim Pei Siang,
Norhanani Jaafar
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Low Temperature Physical Vapour Deposited Cu Seed Layer for Temporary Bonded Wafer Substrates
Abdul Hannan Yeo,
Serine Soh Siew Boon,
David Ho Soon Wee,
Kalyn Lim Tien Shee,
Wei Jun Qi,
Zhang Kang,
Kelvin Boh Tai Ming,
Cheng Ting
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Realization of High Aspect Ratio Through Mold Interconnect (TMI) using Vertical Wire
Leong Ching Wai,
David Ho Soon Wee,
Chong Ser Choong
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
11 Oct 2021
SERC
Institute for Infocomm Research
A Minimal Information Set To Enable Verifiable Theoretical Battery Research
Aashutosh Mistry,
Ankit Verma,
Shashank Sripad,
Rebecca Ciez,
Valentin Sulzer,
Ferran Brosa Planella,
Robert Timms,
Yumin Zhang,
Rachel Kurchin,
Philipp Dechent,
Weihan Li,
Samuel Greenbank,
Zeeshan Ahmad,
Dilip Krishnamurthy,
Alexis M. Fenton,
Kevin Tenny,
Prehit Patel,
Daniel Juarez Robles,
Paul Gasper,
Andrew Colclasure,
Artem Baskin,
Corinne D. Scown,
Venkat R. Subramanian,
Edwin Khoo,
Srikanth Allu,
David Howey,
Steven DeCaluwe,
Scott A. Roberts,
Venkatasubramanian Viswanathan
ACS Energy Letters
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