| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 10 Aug 2021 | SERC | Institute of Microelectronics | Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) | Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| 12 May 2020 | SERC | Institute of Chemical and Engineering Sciences | Degradable poly(alkyl acrylates) with uniform insertion of ester bonds, comparing batch and semibatch copolymerizations | Jean-Baptiste Lena, Alexander W. Jackson, Lohitha Rao Chennamaneni, Chiong Teck Wong, Freda Lim, Yosephine Andriani, Praveen Thoniyot, Alexander M. van Herk | Macromolecules |