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17 Jun 2026
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SERC
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Institute of Microelectronics
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Process Development of Two-Stacked Chips with a Backside Embedded Two-Phase Cooling Solution (Pending publish)
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Xiaowu Zhang,
Boon Long Lau,
Huicheng Feng,
Gongyue Tang,
Ming Chinq Jong,
Surya Bhattacharya,
Vempati Srinivasa Rao,
B.S.S. Chandra Rao,
Tran Van Nhat Anh
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2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
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17 Jun 2026
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SERC
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Institute of Microelectronics
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Process Optimization for Chip-to-Wafer Hybrid Bonding Using Inter-Die Gap Fill Integration Approach (Pending publish)
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Mishra Dileep Kumar,
Vasarla Nagendra Sekhar,
Sasi Kumar Tippabhotla,
Hipona Randy Tupaen,
Norhanani Jaafar,
B.S.S. Chandra Rao,
Daniel Ismael,
Xie Ling,
Ser Choong Chong,
Vempati Srinivasa Rao
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2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
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24 Feb 2026
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SERC
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Institute of Microelectronics
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Numerical Investigation of Embedded Micro Pin-Fin Two-Phase Liquid Cooling for Dual-Chip Stacks in HPC and AI Systems (Pending publish)
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Chinmaya Kumar Patra,
Anandaroop Bhattacharya,
Prasanta Kumar Das,
Xiaowu Zhang,
Surya Bhattacharya,
Vempati Srinivasa Rao
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2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
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24 Feb 2026
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SERC
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Institute of Microelectronics
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Rf and Digital Heterogenous Integration on 2.5D Si-Interposer (Pending publish)
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Leong Ching Wai,
Teck Guan Lim,
Ser Choong Chong,
Yong Chyn Ng,
Vempati Srinivasa Rao
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2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
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26 Jun 2025
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SERC
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Institute of Microelectronics
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Process Development, Challenges, and Strategies for Void-Free Multi-Chip Stacking in Hybrid Bonding Applications (Pending publish)
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Ser Choong Chong,
Ling Xie,
Vasarla Nagendra Sekhar,
Mishra Dileep Kumar,
B.S.S. Chandra Rao,
Vempati Srinivasa Rao
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2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
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26 Jun 2025
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SERC
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Institute of Microelectronics
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Warpage Engineering in C2W Hybrid Bonding Using Inter-Die Gap Fill Dielectrics for 2.5D/3D Integration (Pending publish)
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Mishra Dileep Kumar,
Vasarla Nagendra Sekhar,
Xie Ling,
Cheemalamarri Hemanth Kumar,
Sasi Kumar Tippabhotla,
B.S.S. Chandra Rao,
Hipona Randy Tupaen,
Ser Choong Chong,
Vempati Srinivasa Rao
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2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
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26 Jun 2025
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SERC
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Institute of Microelectronics
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Development of an Embedded 2-Phase Cooling Solution for Two Stacked High-Power Chips in Future HPC HPC and AI Applications (Pending publish)
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Xiaowu Zhang,
Huicheng Feng,
Gongyue Tang,
Boon Long Lau,
Ming Chinq Jong,
Surya Bhattacharya,
Vempati Srinivasa Rao
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2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
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11 Mar 2025
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SERC
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Institute of Microelectronics
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Fabrication of c-Si Pillars on Glass Substrates for Terahertz Dielectric Metasurfaces Using Glass-Silicon Direct Bonding
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Hemanth Kumar Cheemalamarri,
B.S.S.Chandra Rao,
Arvind Sundaram,
Ho Sze Jye Jacky,
Tee Soon Fong,
Prakash Pitchappa,
Nitin Muralidharan Nair,
Navab Singh,
Vempati Srinivasa Rao
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2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
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9 Dec 2024
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SERC
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Institute of Microelectronics
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Low-Thermal Budget TEOS-TEOS Bonding for Multi-Stack HBM Applications
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Hemanth Kumar Cheemalamarri,
Masahisa Fujino,
Ji Hong Miao,
Everline Teo,
Vempati Srinivasa Rao,
Navab Singh
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2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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26 Jun 2024
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SERC
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Institute of Microelectronics
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Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding
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Hemanth Kumar Cheemalamarri,
Arvind Sundaram,
San Sandra,
Tran Van Nhat Anh,
Bhesetti Chandra Rao,
Chen Gim Guan,
Yu Haitao,
Mani Raju,
Luo Ping,
Lee Chaeeun,
Vempati Srinivasa Rao,
Navab Singh
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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