Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2026 SERC Institute of Microelectronics Process Development of Two-Stacked Chips with a Backside Embedded Two-Phase Cooling Solution Xiaowu Zhang, Boon Long Lau, Huicheng Feng, Gongyue Tang, Ming Chinq Jong, Surya Bhattacharya, Vempati Srinivasa Rao, B.S.S. Chandra Rao, Tran Van Nhat Anh 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
17 Jun 2026 SERC Institute of Microelectronics Process Optimization for Chip-to-Wafer Hybrid Bonding Using Inter-Die Gap Fill Integration Approach (Pending publish) Mishra Dileep Kumar, Vasarla Nagendra Sekhar, Sasi Kumar Tippabhotla, Hipona Randy Tupaen, Norhanani Jaafar, B.S.S. Chandra Rao, Daniel Ismael, Xie Ling, Ser Choong Chong, Vempati Srinivasa Rao 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
24 Feb 2026 SERC Institute of Microelectronics Numerical Investigation of Embedded Micro Pin-Fin Two-Phase Liquid Cooling for Dual-Chip Stacks in HPC and AI Systems Chinmaya Kumar Patra, Anandaroop Bhattacharya, Prasanta Kumar Das, Xiaowu Zhang, Surya Bhattacharya, Vempati Srinivasa Rao 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
24 Feb 2026 SERC Institute of Microelectronics Rf and Digital Heterogenous Integration on 2.5D Si-Interposer Leong Ching Wai, Teck Guan Lim, Ser Choong Chong, Yong Chyn Ng, Vempati Srinivasa Rao 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
26 Jun 2025 SERC Institute of Microelectronics Process Development, Challenges, and Strategies for Void-Free Multi-Chip Stacking in Hybrid Bonding Applications Ser Choong Chong, Ling Xie, Vasarla Nagendra Sekhar, Mishra Dileep Kumar, B.S.S. Chandra Rao, Vempati Srinivasa Rao 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2025 SERC Institute of Microelectronics Development of an Embedded 2-Phase Cooling Solution for Two Stacked High-Power Chips in Future HPC HPC and AI Applications Xiaowu Zhang, Huicheng Feng, Gongyue Tang, Boon Long Lau, Ming Chinq Jong, Surya Bhattacharya, Vempati Srinivasa Rao 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
11 Mar 2025 SERC Institute of Microelectronics Fabrication of c-Si Pillars on Glass Substrates for Terahertz Dielectric Metasurfaces Using Glass-Silicon Direct Bonding Hemanth Kumar Cheemalamarri, B.S.S.Chandra Rao, Arvind Sundaram, Ho Sze Jye Jacky, Tee Soon Fong, Prakash Pitchappa, Nitin Muralidharan Nair, Navab Singh, Vempati Srinivasa Rao 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
9 Dec 2024 SERC Institute of Microelectronics Low-Thermal Budget TEOS-TEOS Bonding for Multi-Stack HBM Applications Hemanth Kumar Cheemalamarri, Masahisa Fujino, Ji Hong Miao, Everline Teo, Vempati Srinivasa Rao, Navab Singh 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
26 Jun 2024 SERC Institute of Microelectronics Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding Hemanth Kumar Cheemalamarri, Arvind Sundaram, San Sandra, Tran Van Nhat Anh, Bhesetti Chandra Rao, Chen Gim Guan, Yu Haitao, Mani Raju, Luo Ping, Lee Chaeeun, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Cu/Dielectric hybrid bonding among Glass and Si Hemanth Kumar Cheemalamarri, Arvind Sundaram, Tran Van Nhat Anh, Yoo Jae Ok, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)