| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Cu and barrier CMP process development with fine 1μm Cu bond pad and 2.5 μm pitch for Wafer-to-wafer Hybrid Bonding | Sangita Chaki Roy, Chen Gim Guan, Nandini Venkataraman, Wen Lee, Navab Singh | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |