Low-Thermal Budget TEOS-TEOS Bonding for Multi-Stack HBM Applications

Low-Thermal Budget TEOS-TEOS Bonding for Multi-Stack HBM Applications

2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

10.1109/LTB-3D64053.2024.10774117

https://doi.org/10.1109/ltb-3d64053.2024.10774117

Hemanth Kumar Cheemalamarri, Masahisa Fujino, Ji Hong Miao, Everline Teo, Vempati Srinivasa Rao, Navab Singh

09 December 2024

Cheemalamarri, H. K., Fujino, M., Miao, J. H., Teo, E., Rao, V. S., & Singh, N. (2024). Low-Thermal Budget TEOS-TEOS Bonding for Multi-Stack HBM Applications. 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 1–1. https://doi.org/10.1109/ltb-3d64053.2024.10774117

In this study, the impact of annealing time with reduced thermal budget on the interfacial bond energy of oxide to oxide has been evaluated. Bonding energy was systematically analyzed under various annealing conditions. Additionally, this work proposed a standardized Maszara’s test measurement interval to accurately assess the bonding performance for TEOS-TEOS oxide dielectric interfaces.

Publisher Copyright

This research / project is supported by the Agency for Science, Technology and Research - Applied Centre of Excellence in Advanced Packaging 3.0
Grant Reference no. : I2101E0008

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