Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
6 Dec 2024 | SERC | Institute for Infocomm Research | Accelerating Bonding Overlay Error Optimization in Fine-Pitch Wafer-to-Wafer Hybrid Bonding through Machine Learning | Ashish James, Nandini Venkataraman, Ji Hong Miao, Navab Singh, Xiaoli Li | 26th IEEE Electronics Packaging Technology Conference (EPTC) |
5 Jan 2022 | SERC | Institute of Microelectronics | Development of Metallization Process for Fine Pitch TSV | Gilho Hwang, Ji Hong Miao, B.S.S Chandra Rao | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |