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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Sep 2024 SERC Institute of Microelectronics 1D Line-scan Metalens Integrated with MEMS Actuator for Depth Sensing Applications (Pending publish) Yuan Hsing Fu, Roberto Carminati, Huanhuan Wang, Leh Woon Lim, Narak Choi, Keng Heng Lai, Charmaine Shuyan Goh, Yat Fung Tsang, Navab Singh, Qingxin Zhang CLEO 2024
16 May 2024 SERC Institute of Microelectronics First Demonstration of High‐Frequency InAlN/GaN High‐Electron‐Mobility Transistor Using GaN‐on‐Insulator Technology via 200 mm Wafer Bonding (Pending publish) Hanchao Li, Hanlin Xie, Yue Wang, Lekina Yulia, Kumud Ranjan, Navab Singh, Surasit Chung, Kenneth E. Lee, Subramaniam Arulkumaran, Geok Ing Ng physica status solidi (a)
18 Mar 2024 SERC Institute of Microelectronics Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding Hemanth Kumar Cheemalamarri, Ji Lir, Wen Lee, Vempati Srinivasa Rao, Navab Singh 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Cu and barrier CMP process development with fine 1μm Cu bond pad and 2.5 μm pitch for Wafer-to-wafer Hybrid Bonding Sangita Chaki Roy, Chen Gim Guan, Nandini Venkataraman, Wen Lee, Navab Singh 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics CMOS-Compatible Fine Pitch Al-Al Bonding Hemanth Kumar Cheemalamarri, Binni Varghese, Sharma Jaibir, Li Hongyu, Chandra Rao S S, Navab Singh, Vempati Srinivasa Rao, King-Jien Chui 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography Arvind Sundaram, Chin Khang Tew, Guo Wei Tan, Yuan-Hsing Fu, Hongyu Li, Nandini Venkataraman, Bhesetti Chandra Rao, Navab Singh 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Doping-selective etching of silicon for wafer thinning in the fabrication of backside-illuminated stacked CMOS image sensors Nandini Venkataraman, Benedikt Risse, Gregorio Decierdo, Navab Singh, Darshini Senthilkumar, Deepthi Kandasamy, Eng Huat Toh, Louis Lim 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
15 Mar 2023 SERC Institute of Microelectronics Model-based optical proximity correction for immersion lithography-based flat optics platform Narak Choi, Keng Heng Lai, Arvind Sundaram, Navab Singh, Yuan Hsing Fu, Lennon Yao Ting Lee High Contrast Metastructures XII
15 Mar 2021 SERC Institute of Microelectronics Improved Specific Detectivity to 107 for CMOS-MEMS Pyroelectric Detector Based on 12%-Doped Scandium Aluminum Nitride Doris K. T. Ng, Tantan Zhang, Li-Yan Siow, Linfang Xu, Chong-Pei Ho, Hong Cai, Lennon Y. T. Lee, Qingxin Zhang, Navab Singh 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)
28 Sep 2020 SERC Institute of Microelectronics Metasurface-based subtractive color filter fabricated on a 12-inch glass wafer using a CMOS platform Zhengji Xu, Nanxi Li, Yuan Dong, Yuan Hsing Fu, Ting Hu, Qize Zhong, Yanyan Zhou, Dongdong Li, Shiyang Zhu, Navab Singh Photonics Research