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18 Sep 2024
SERC
Institute of Microelectronics
1D Line-scan Metalens Integrated with MEMS Actuator for Depth Sensing Applications
(Pending publish)
Yuan Hsing Fu,
Roberto Carminati,
Huanhuan Wang,
Leh Woon Lim,
Narak Choi,
Keng Heng Lai,
Charmaine Shuyan Goh,
Yat Fung Tsang,
Navab Singh,
Qingxin Zhang
CLEO 2024
16 May 2024
SERC
Institute of Microelectronics
First Demonstration of High‐Frequency InAlN/GaN High‐Electron‐Mobility Transistor Using GaN‐on‐Insulator Technology via 200 mm Wafer Bonding
(Pending publish)
Hanchao Li,
Hanlin Xie,
Yue Wang,
Lekina Yulia,
Kumud Ranjan,
Navab Singh,
Surasit Chung,
Kenneth E. Lee,
Subramaniam Arulkumaran,
Geok Ing Ng
physica status solidi (a)
18 Mar 2024
SERC
Institute of Microelectronics
Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding
Hemanth Kumar Cheemalamarri,
Ji Lir,
Wen Lee,
Vempati Srinivasa Rao,
Navab Singh
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Cu and barrier CMP process development with fine 1μm Cu bond pad and 2.5 μm pitch for Wafer-to-wafer Hybrid Bonding
Sangita Chaki Roy,
Chen Gim Guan,
Nandini Venkataraman,
Wen Lee,
Navab Singh
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023
SERC
Institute of Microelectronics
CMOS-Compatible Fine Pitch Al-Al Bonding
Hemanth Kumar Cheemalamarri,
Binni Varghese,
Sharma Jaibir,
Li Hongyu,
Chandra Rao S S,
Navab Singh,
Vempati Srinivasa Rao,
King-Jien Chui
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023
SERC
Institute of Microelectronics
Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography
Arvind Sundaram,
Chin Khang Tew,
Guo Wei Tan,
Yuan-Hsing Fu,
Hongyu Li,
Nandini Venkataraman,
Bhesetti Chandra Rao,
Navab Singh
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023
SERC
Institute of Microelectronics
Doping-selective etching of silicon for wafer thinning in the fabrication of backside-illuminated stacked CMOS image sensors
Nandini Venkataraman,
Benedikt Risse,
Gregorio Decierdo,
Navab Singh,
Darshini Senthilkumar,
Deepthi Kandasamy,
Eng Huat Toh,
Louis Lim
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
15 Mar 2023
SERC
Institute of Microelectronics
Model-based optical proximity correction for immersion lithography-based flat optics platform
Narak Choi,
Keng Heng Lai,
Arvind Sundaram,
Navab Singh,
Yuan Hsing Fu,
Lennon Yao Ting Lee
High Contrast Metastructures XII
15 Mar 2021
SERC
Institute of Microelectronics
Improved Specific Detectivity to 107 for CMOS-MEMS Pyroelectric Detector Based on 12%-Doped Scandium Aluminum Nitride
Doris K. T. Ng,
Tantan Zhang,
Li-Yan Siow,
Linfang Xu,
Chong-Pei Ho,
Hong Cai,
Lennon Y. T. Lee,
Qingxin Zhang,
Navab Singh
2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)
28 Sep 2020
SERC
Institute of Microelectronics
Metasurface-based subtractive color filter fabricated on a 12-inch glass wafer using a CMOS platform
Zhengji Xu,
Nanxi Li,
Yuan Dong,
Yuan Hsing Fu,
Ting Hu,
Qize Zhong,
Yanyan Zhou,
Dongdong Li,
Shiyang Zhu,
Navab Singh
Photonics Research
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