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Publication date Communities Collections Article title Author(s) Journal/Conference
26 Jun 2025 SERC Institute of Microelectronics Novel Selective Metal Capping on Cu pad Enabling Void-Free Hybrid Bonding at Low Thermal Budgets, Irrespective of Cu Topography and Microstructure Hemanth Kumar Cheemalamarri, Masahisa Fujino, Chandra Rao Bhesetti, Lau Boon Long, Mishra Dileep, Srinivasa Rao Vempati, Navab Singh 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
11 Mar 2025 SERC Institute of Microelectronics Fabrication of c-Si Pillars on Glass Substrates for Terahertz Dielectric Metasurfaces Using Glass-Silicon Direct Bonding Hemanth Kumar Cheemalamarri, B.S.S.Chandra Rao, Arvind Sundaram, Ho Sze Jye Jacky, Tee Soon Fong, Prakash Pitchappa, Nitin Muralidharan Nair, Navab Singh, Vempati Srinivasa Rao 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
9 Dec 2024 SERC Institute of Microelectronics Low-Thermal Budget TEOS-TEOS Bonding for Multi-Stack HBM Applications Hemanth Kumar Cheemalamarri, Masahisa Fujino, Ji Hong Miao, Everline Teo, Vempati Srinivasa Rao, Navab Singh 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
6 Dec 2024 SERC Institute for Infocomm Research Accelerating Bonding Overlay Error Optimization in Fine-Pitch Wafer-to-Wafer Hybrid Bonding through Machine Learning Ashish James, Nandini Venkataraman, Ji Hong Miao, Navab Singh, Xiaoli Li 26th IEEE Electronics Packaging Technology Conference (EPTC)
18 Sep 2024 SERC Institute of Microelectronics 1D Line-scan Metalens Integrated with MEMS Actuator for Depth Sensing Applications Yuan Hsing Fu, Roberto Carminati, Huanhuan Wang, Leh Woon Lim, Narak Choi, Keng Heng Lai, Charmaine Shuyan Goh, Yat Fung Tsang, Navab Singh, Qingxin Zhang Conference on Lasers and Electro-Optics 2024
26 Jun 2024 SERC Institute of Microelectronics Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding Hemanth Kumar Cheemalamarri, Arvind Sundaram, San Sandra, Tran Van Nhat Anh, Bhesetti Chandra Rao, Chen Gim Guan, Yu Haitao, Mani Raju, Luo Ping, Lee Chaeeun, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Cu/Dielectric hybrid bonding among Glass and Si Hemanth Kumar Cheemalamarri, Arvind Sundaram, Tran Van Nhat Anh, Yoo Jae Ok, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications Hemanth Kumar Cheemalamarri, Tran Van Nhat Anh, Chen Gim Guan, Meng Keong Lim, Srinivasa Rao Vempati, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
16 May 2024 SERC Institute of Microelectronics First Demonstration of High‐Frequency InAlN/GaN High‐Electron‐Mobility Transistor Using GaN‐on‐Insulator Technology via 200 mm Wafer Bonding Hanchao Li, Hanlin Xie, Yue Wang, Lekina Yulia, Kumud Ranjan, Navab Singh, Surasit Chung, Kenneth E. Lee, Subramaniam Arulkumaran, Geok Ing Ng physica status solidi (a)
14 May 2024 SERC Institute of Microelectronics 1 Million Intrinsic Q-Factor Microring Resonators From PVD Aluminum Nitride on SiO2-on-Si Substrate Amy S. K. Tong, Wing Wai Chung, Charmaine Goh, Landobasa Y. M. Tobing, Leh Woon Lim, Yuriy A. Akimov, Zhan Jiang Quek, Aravind P. Anthur, Jia Sheng Goh, Huamao Lin, Navab Singh, Qingxin Zhang, Doris K. T. Ng Optical Fiber Communication Conference (OFC) 2024