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18 Mar 2024 SERC Institute of Microelectronics Optimization of the CMP process for direct wafer-to-wafer oxide bonding Hong-Miao Ji, Hemanth Kumar Cheemalamarri, Ting-Ta Chi, Hui-ting Lim Serene, Wei-Jie Teo Dickson, Siang-Kiat Neo Alfred, Hong-Yu Li, Gim-Guan Chen Jon, Nandini Venkataraman, Wen Lee 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding Hemanth Kumar Cheemalamarri, Ji Lir, Wen Lee, Vempati Srinivasa Rao, Navab Singh 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics CMOS-Compatible Fine Pitch Al-Al Bonding Hemanth Kumar Cheemalamarri, Binni Varghese, Sharma Jaibir, Li Hongyu, Chandra Rao S S, Navab Singh, Vempati Srinivasa Rao, King-Jien Chui 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)