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Publication date Communities Collections Article title Author(s) Journal/Conference
26 Jun 2025 SERC Institute of Microelectronics Novel Selective Metal Capping on Cu pad Enabling Void-Free Hybrid Bonding at Low Thermal Budgets, Irrespective of Cu Topography and Microstructure Hemanth Kumar Cheemalamarri, Masahisa Fujino, Chandra Rao Bhesetti, Lau Boon Long, Mishra Dileep, Srinivasa Rao Vempati, Navab Singh 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
11 Mar 2025 SERC Institute of Microelectronics Fabrication of c-Si Pillars on Glass Substrates for Terahertz Dielectric Metasurfaces Using Glass-Silicon Direct Bonding Hemanth Kumar Cheemalamarri, B.S.S.Chandra Rao, Arvind Sundaram, Ho Sze Jye Jacky, Tee Soon Fong, Prakash Pitchappa, Nitin Muralidharan Nair, Navab Singh, Vempati Srinivasa Rao 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
9 Dec 2024 SERC Institute of Microelectronics Low-Thermal Budget TEOS-TEOS Bonding for Multi-Stack HBM Applications Hemanth Kumar Cheemalamarri, Masahisa Fujino, Ji Hong Miao, Everline Teo, Vempati Srinivasa Rao, Navab Singh 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
26 Jun 2024 SERC Institute of Microelectronics Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding Hemanth Kumar Cheemalamarri, Arvind Sundaram, San Sandra, Tran Van Nhat Anh, Bhesetti Chandra Rao, Chen Gim Guan, Yu Haitao, Mani Raju, Luo Ping, Lee Chaeeun, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Cu/Dielectric hybrid bonding among Glass and Si Hemanth Kumar Cheemalamarri, Arvind Sundaram, Tran Van Nhat Anh, Yoo Jae Ok, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications Hemanth Kumar Cheemalamarri, Tran Van Nhat Anh, Chen Gim Guan, Meng Keong Lim, Srinivasa Rao Vempati, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Optimization of the CMP process for direct wafer-to-wafer oxide bonding Hong-Miao Ji, Hemanth Kumar Cheemalamarri, Ting-Ta Chi, Hui-ting Lim Serene, Wei-Jie Teo Dickson, Siang-Kiat Neo Alfred, Hong-Yu Li, Gim-Guan Chen Jon, Nandini Venkataraman, Wen Lee 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding Hemanth Kumar Cheemalamarri, Ji Lir, Wen Lee, Vempati Srinivasa Rao, Navab Singh 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics CMOS-Compatible Fine Pitch Al-Al Bonding Hemanth Kumar Cheemalamarri, Binni Varghese, Sharma Jaibir, Li Hongyu, Chandra Rao S S, Navab Singh, Vempati Srinivasa Rao, King-Jien Chui 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)