| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 26 Jun 2024 | SERC | Institute of Microelectronics | Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding | Hemanth Kumar Cheemalamarri, Arvind Sundaram, San Sandra, Tran Van Nhat Anh, Bhesetti Chandra Rao, Chen Gim Guan, Yu Haitao, Mani Raju, Luo Ping, Lee Chaeeun, Vempati Srinivasa Rao, Navab Singh | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
| 3 Aug 2023 | SERC | Institute of Microelectronics | Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography | Arvind Sundaram, Chin Khang Tew, Guo Wei Tan, Yuan-Hsing Fu, Hongyu Li, Nandini Venkataraman, Bhesetti Chandra Rao, Navab Singh | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |