| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 3 Aug 2023 | SERC | Institute of Microelectronics | Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography | Arvind Sundaram, Chin Khang Tew, Guo Wei Tan, Yuan-Hsing Fu, Hongyu Li, Nandini Venkataraman, Bhesetti Chandra Rao, Navab Singh | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |