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8 Dec 2025
SERC
Institute for Infocomm Research
Understanding Patients’ Real-World Experiences with Diabetes Self-Management: A Mixed-Methods Study
Mojisola Erdt,
Siti Umairah Md. Salleh,
Sakinah Binte Yusof,
Siti Maryam Binte Ahmad Subaidi,
Nabilah Binte Md. Johan Md. Johan,
Yuanyuan Cao,
Yen Yu Chen,
Nancy F. Chen,
Yong Mong Bee,
Wen Lee Tan,
Pavitra Krishnaswamy
Singapore Scientific Conference (SSC) 2025
24 Apr 2025
BMRC
Singapore Institute of Food and Biotechnology Innovation
Influence of mixed plant protein combinations on the physicochemical, textural, structural and nutritional properties of extruded high-moisture meat analogues
Dayna Shu Min Ong,
Xin Yi Hua,
Alicia Hui Ping Theng,
Bisma Mutiargo,
Hui Wen Lee,
Raffael Osen,
Jie Hong Chiang
Journal of Food Engineering
7 Apr 2025
SERC
Institute for Infocomm Research
A Mixed-Methods Study on Understanding Patients’ Real-life Experiences with Self-monitoring of Blood Glucose
Mojisola Erdt,
Siti Umairah Md. Salleh,
Sakinah Binte Yusof,
Siti Maryam Binte Ahmad Subaidi,
Nabilah Binte Md. Johan,
Yuanyuan Cao,
Yen Yu Chen,
Nancy F. Chen,
Yong Mong Bee,
Wen Lee Tan,
Pavitra Krishnaswamy
IDF World Diabetes Congress 2025
15 Jun 2024
BMRC
Singapore Institute of Food and Biotechnology Innovation
Nutritional, anti-nutrient, stability and organoleptic characterisation of plant-based milk alternatives derived from adzuki bean (Vigna angularis) and mung bean (Vigna radiata)
Dayna Shu Min Ong,
Hui Wen Lee,
Michelle Ting Yun Yeo,
Jie Hong Chiang
Future Foods
18 Mar 2024
SERC
Institute of Microelectronics
A Novel Packaging Solution for Photonic Engine Application
Xu Feng,
Li Zhenyu,
Wen Lee
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Optimization of the CMP process for direct wafer-to-wafer oxide bonding
Hong-Miao Ji,
Hemanth Kumar Cheemalamarri,
Ting-Ta Chi,
Hui-ting Lim Serene,
Wei-Jie Teo Dickson,
Siang-Kiat Neo Alfred,
Hong-Yu Li,
Gim-Guan Chen Jon,
Nandini Venkataraman,
Wen Lee
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding
Hemanth Kumar Cheemalamarri,
Ji Lir,
Wen Lee,
Vempati Srinivasa Rao,
Navab Singh
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Cu and barrier CMP process development with fine 1μm Cu bond pad and 2.5 μm pitch for Wafer-to-wafer Hybrid Bonding
Sangita Chaki Roy,
Chen Gim Guan,
Nandini Venkataraman,
Wen Lee,
Navab Singh
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
27 Oct 2023
BMRC
Singapore Institute of Food and Biotechnology Innovation
Comparative evaluation of minerals content of common green leafy vegetables consumed by the Asian populations in Singapore
Hui Wen Lee,
Xinyan BI,
Christiani Jeyakumar Henry
Journal of Food Composition and Analysis
22 Sep 2023
BMRC
Singapore Institute of Food and Biotechnology Innovation
Assessment of oxalates and phytic acid contents in Asian green leafy vegetables: Dietary recommendations
Hui Wen Lee,
Xinyan BI,
Christiani Jeyakumar Henry
Food and Humanity
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