| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Optimization of the CMP process for direct wafer-to-wafer oxide bonding | Hong-Miao Ji, Hemanth Kumar Cheemalamarri, Ting-Ta Chi, Hui-ting Lim Serene, Wei-Jie Teo Dickson, Siang-Kiat Neo Alfred, Hong-Yu Li, Gim-Guan Chen Jon, Nandini Venkataraman, Wen Lee | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |