| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding | Hemanth Kumar Cheemalamarri, Ji Lir, Wen Lee, Vempati Srinivasa Rao, Navab Singh | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |