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Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2026 SERC Institute of Microelectronics Process Optimization for Chip-to-Wafer Hybrid Bonding Using Inter-Die Gap Fill Integration Approach (Pending publish) Mishra Dileep Kumar, Vasarla Nagendra Sekhar, Sasi Kumar Tippabhotla, Hipona Randy Tupaen, Norhanani Jaafar, B.S.S. Chandra Rao, Daniel Ismael, Xie Ling, Ser Choong Chong, Vempati Srinivasa Rao 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
24 Feb 2026 SERC Institute of Microelectronics Rf and Digital Heterogenous Integration on 2.5D Si-Interposer Leong Ching Wai, Teck Guan Lim, Ser Choong Chong, Yong Chyn Ng, Vempati Srinivasa Rao 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
24 Feb 2026 SERC Institute for Infocomm Research Generative AI-Powered Defect Detection for 3D X-Ray Microscopy Scans of High Bandwidth Memory Bumps Richard Chang, Jie Wang, Yang Yu, Meng Keong Lim, Ser Choong Chong, Ramanpreet Singh Pahwa, Xulei Yang 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
24 Feb 2026 SERC Institute for Infocomm Research AI-Powered Super-Resolution for Scalable and Efficient 3D X-Ray Inspection of 3D-Stacked HBMs Yang Yu, Kangkang Lu, Jie Wang, Richard Chang, Meng Keong Lim, Ser Choong Chong, Ramanpreet Singh Pahwa, Xulei Yang 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
26 Jun 2025 SERC Institute of Microelectronics Process Development, Challenges, and Strategies for Void-Free Multi-Chip Stacking in Hybrid Bonding Applications Ser Choong Chong, Ling Xie, Vasarla Nagendra Sekhar, Mishra Dileep Kumar, B.S.S. Chandra Rao, Vempati Srinivasa Rao 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2025 SERC Institute for Infocomm Research Efficient Visual Inspection Framework of High-Bandwidth Memory Bumps with Generative and Deep Learning AI Richard Chang, Jie Wang, Ser Choong Chong, Xulei Yang, Ramanpreet Singh Pahwa 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2025 SERC Institute for Infocomm Research An Efficient Data Augmentation and Semantic Segmentation Framework for 3D Defect Detection of HBMs Yang Yu, Jie Wang, Richard Chang, Ser Choong Chong, Ramanpreet Singh Pahwa, Xulei Yang 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
11 Mar 2025 SERC Institute for Infocomm Research End-to-End Fast Segmentation Framework for 3D Visual Inspection of HBMs Jie Wang, Richard Chang, Meng Keong Lim, Ser Choong Chong, Xulei Yang, Ramanpreet Singh Pahwa 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
7 Nov 2024 SERC Institute of Microelectronics 1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics Xin Li, Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu, Teck Guan Lim, Pengfei Guo, Jaye Charles Davies, Edward Sing Chee Koh, Boon Long Lau, Ming Chinq Jong, Ser Choong Chong, San Sandra, Chao Li, Guo-Qiang Lo, Surya Bhattacharya, Jason Tsung-Yang Liow Journal of Lightwave Technology
26 Jun 2024 SERC Institute of Microelectronics Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking Mishra Dileep Kumar, Vasarla Nagendra Sekhar, B.S.S. Chandra Rao, Ser Choong Chong, Vempati Srinivasa Rao 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)