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Publication date Communities Collections Article title Author(s) Journal/Conference
26 Jun 2025 SERC Institute of Microelectronics Addressing Key Process Challenges in Developing High Aspect Ratio TSVs up to 15 with 1 μm Critical Dimension (Pending publish) Tran Van Nhat Anh, Nandini Venkataraman, Ya-Ching Tseng, Arvind Sundaram, Binni Varghese, Heng Zeng Wei, B.S.S. Chandra Rao 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
11 Mar 2025 SERC Institute of Microelectronics Fabrication of c-Si Pillars on Glass Substrates for Terahertz Dielectric Metasurfaces Using Glass-Silicon Direct Bonding Hemanth Kumar Cheemalamarri, B.S.S.Chandra Rao, Arvind Sundaram, Ho Sze Jye Jacky, Tee Soon Fong, Prakash Pitchappa, Nitin Muralidharan Nair, Navab Singh, Vempati Srinivasa Rao 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
6 Dec 2024 SERC Institute of Microelectronics Patterning of 1µm Critical Dimension Through Silicon Via using Positive Tone Resist Mask by a Photolithography Stepper Arvind Sundaram, Riley Kang, Chandra Bhesetti Rao EPTC 2024: IEEE Electronics Packaging Technology Conference
26 Jun 2024 SERC Institute of Microelectronics Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding Hemanth Kumar Cheemalamarri, Arvind Sundaram, San Sandra, Tran Van Nhat Anh, Bhesetti Chandra Rao, Chen Gim Guan, Yu Haitao, Mani Raju, Luo Ping, Lee Chaeeun, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Cu/Dielectric hybrid bonding among Glass and Si Hemanth Kumar Cheemalamarri, Arvind Sundaram, Tran Van Nhat Anh, Yoo Jae Ok, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics A Precise Wafer Thinning Integration Process for nano-TSV Formation Ya-Ching Tseng, Simon Chun Kiat Goh, Senthilkumar Darshini, Nandini Venkataraman, Arvind Sundaram, Tew Chin Khang, Yoo Jae Ok, King-Jien Chui 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission Ting Ta Chi, Zhenyu Li, Nanxi Li, Hong Cai, Y M Tobing Landobasa, Haitao Yu, Senthilkumar Darshini, Jae Ok Yoo, Arvind Sundaram, B.S.S. Chandra Rao, Lennon Y. T. Lee, Wen Lee 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography Arvind Sundaram, Chin Khang Tew, Guo Wei Tan, Yuan-Hsing Fu, Hongyu Li, Nandini Venkataraman, Bhesetti Chandra Rao, Navab Singh 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
15 Mar 2023 SERC Institute of Microelectronics Model-based optical proximity correction for immersion lithography-based flat optics platform Narak Choi, Keng Heng Lai, Arvind Sundaram, Navab Singh, Yuan Hsing Fu, Lennon Yao Ting Lee High Contrast Metastructures XII