| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 3 Aug 2023 | SERC | Institute of Microelectronics | A Precise Wafer Thinning Integration Process for nano-TSV Formation | Ya-Ching Tseng, Simon Chun Kiat Goh, Senthilkumar Darshini, Nandini Venkataraman, Arvind Sundaram, Tew Chin Khang, Yoo Jae Ok, King-Jien Chui | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |