Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
26 Jun 2024 SERC Institute of Microelectronics Electrical Characterization and Reliability Studies of Nano-TSV (Pending publish) Ya-Ching Tseng, King-Jien Chui, Simon Chun Kiat Goh, Daniel Lau, Hongyu Li, Tran Van Nhat Anh, Haitao Yu, Chin Khang Tew, Gim Guan Chen, Binni Varghese, Calvin Chua Hung Ming 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Investigation of Immersion Alignment Mark Signal and Alignment Success Rate for Flat Optics with Aperture on Chip (Pending publish) Chin Khang Tew, Landobasa Y. M. Tobing, Jae Ok Yoo, Navab Singh 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography Arvind Sundaram, Chin Khang Tew, Guo Wei Tan, Yuan-Hsing Fu, Hongyu Li, Nandini Venkataraman, Bhesetti Chandra Rao, Navab Singh 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)