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26 Jun 2024
SERC
Institute of Microelectronics
Electrical Characterization and Reliability Studies of Nano-TSV
(Pending publish)
Ya-Ching Tseng,
King-Jien Chui,
Simon Chun Kiat Goh,
Daniel Lau,
Hongyu Li,
Tran Van Nhat Anh,
Haitao Yu,
Chin Khang Tew,
Gim Guan Chen,
Binni Varghese,
Calvin Chua Hung Ming
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024
SERC
Institute of Microelectronics
Investigation of Immersion Alignment Mark Signal and Alignment Success Rate for Flat Optics with Aperture on Chip
(Pending publish)
Chin Khang Tew,
Landobasa Y. M. Tobing,
Jae Ok Yoo,
Navab Singh
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023
SERC
Institute of Microelectronics
Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography
Arvind Sundaram,
Chin Khang Tew,
Guo Wei Tan,
Yuan-Hsing Fu,
Hongyu Li,
Nandini Venkataraman,
Bhesetti Chandra Rao,
Navab Singh
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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