Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
26 Jun 2024 | SERC | Institute of Microelectronics | Electrical Characterization and Reliability Studies of Nano-TSV | Ya-Ching Tseng, King-Jien Chui, Simon Chun Kiat Goh, Daniel Lau, Hongyu Li, Tran Van Nhat Anh, Haitao Yu, Chin Khang Tew, Gim Guan Chen, Binni Varghese, Calvin Chua Hung Ming | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
3 Aug 2023 | SERC | Institute of Microelectronics | Alignment through thick Si layer for high resolution patterning on bonded wafers with tight overlay margin using immersion lithography | Arvind Sundaram, Chin Khang Tew, Guo Wei Tan, Yuan-Hsing Fu, Hongyu Li, Nandini Venkataraman, Bhesetti Chandra Rao, Navab Singh | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |