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Publication date Communities Collections Article title Author(s) Journal/Conference
26 Jun 2024 SERC Institute of Microelectronics Electrical Characterization and Reliability Studies of Nano-TSV Ya-Ching Tseng, King-Jien Chui, Simon Chun Kiat Goh, Daniel Lau, Hongyu Li, Tran Van Nhat Anh, Haitao Yu, Chin Khang Tew, Gim Guan Chen, Binni Varghese, Calvin Chua Hung Ming 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Indium-based Flip-chip Interconnect for Cryogenic Packaging Norhanani Binte Jaafar, Li Hongyu, Chong Ser Choong, Ng Yong Chyn, Ding Huang, Chit Siong Lau, Kuan Eng Johnson Goh, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Process and Integration Challenges for Via Last TSV (from top) on Functional LNA SOI wafers for 3D Heterogeneous chiplet integration Xiangyu Wang, Mihai Dragos Rotaru, Yu Haitao, Mingchinq Jonq, Chai Tai Chong, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics A Precise Wafer Thinning Integration Process for nano-TSV Formation Ya-Ching Tseng, Simon Chun Kiat Goh, Senthilkumar Darshini, Nandini Venkataraman, Arvind Sundaram, Tew Chin Khang, Yoo Jae Ok, King-Jien Chui 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics CMOS-Compatible Fine Pitch Al-Al Bonding Hemanth Kumar Cheemalamarri, Binni Varghese, Sharma Jaibir, Li Hongyu, Chandra Rao S S, Navab Singh, Vempati Srinivasa Rao, King-Jien Chui 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Demonstration of a CMOS-Compatible Superconducting Cryogenic Interposer for Advanced Quantum Processors King-Jien Chui, Hongyu Li, Yong Chyn Ng, Chit Siong Lau, K. E. J. Goh, D. Huang, Ya-Ching Tseng, J. K. Chen, H. Yu, B. N. Jaafar, H. Lin, B. Varghese 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding Hongmiao Ji, King-Jien Chui 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
4 Oct 2021 SERC Institute of Microelectronics 3D Cryogenic Interposer for Quantum Computing Application Hongyu Li, Chit Siong Aaron Lau, Norhanani Jaafar, Rainer Cheow Siong Lee, Calvin Pei Yu Wong, Kuan Eng Johnson Goh, King-Jien Chui 2022 IEEE 72nd Electronic Components and Technology Conference
10 Aug 2021 SERC Institute of Microelectronics One-step TSV process development for 4-layer wafer stacked DRAM Masaya Kawano, Xiang-Yu Wang, Qin Ren, Woon-Leng Loh, BSS. Chandra Rao, King-Jien Chui 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ) Woon Leng Loh, Xiangyu Wang, Zhaohui Chen, Mingbin Yu, King-Jien Chui 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)