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5 Jan 2022
SERC
Institute of Microelectronics
Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding
Hongmiao Ji,
King-Jien Chui
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
4 Oct 2021
SERC
Institute of Microelectronics
3D Cryogenic Interposer for Quantum Computing Application
Hongyu Li,
Chit Siong Aaron Lau,
Norhanani Jaafar,
Rainer Cheow Siong Lee,
Calvin Pei Yu Wong,
Kuan Eng Johnson Goh,
King-Jien Chui
2022 IEEE 72nd Electronic Components and Technology Conference
10 Aug 2021
SERC
Institute of Microelectronics
One-step TSV process development for 4-layer wafer stacked DRAM
Masaya Kawano,
Xiang-Yu Wang,
Qin Ren,
Woon-Leng Loh,
BSS. Chandra Rao,
King-Jien Chui
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
30 May 2017
SERC
Institute of Microelectronics
A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ)
Woon Leng Loh,
Xiangyu Wang,
Zhaohui Chen,
Mingbin Yu,
King-Jien Chui
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017
SERC
Institute of Microelectronics
Electrical Characterization of CMP-less Via-Last TSV under Reliability Stress Conditions
King-Jien Chui,
Mingbin Yu
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
23 Jun 2015
SERC
Institute of Microelectronics
Heterogeneous 2.5D integration on through silicon interposer
Xiaowu Zhang,
Jong Kai Lin,
Sunil Wickramanayaka,
Songbai Zhang,
Roshan Weerasekera,
Rahul Dutta,
Ka Fai Chang,
King-Jien Chui,
Hong Yu Li,
David Ho,
Liang Ding,
Guruprasad Katti,
Suryanarayana Bhattacharya,
Dim-Lee Kwong
Applied Physics Reviews
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