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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding Hongmiao Ji, King-Jien Chui 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
4 Oct 2021 SERC Institute of Microelectronics 3D Cryogenic Interposer for Quantum Computing Application Hongyu Li, Chit Siong Aaron Lau, Norhanani Jaafar, Rainer Cheow Siong Lee, Calvin Pei Yu Wong, Kuan Eng Johnson Goh, King-Jien Chui 2022 IEEE 72nd Electronic Components and Technology Conference
10 Aug 2021 SERC Institute of Microelectronics One-step TSV process development for 4-layer wafer stacked DRAM Masaya Kawano, Xiang-Yu Wang, Qin Ren, Woon-Leng Loh, BSS. Chandra Rao, King-Jien Chui 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Electrical Characterization of CMP-less Via-Last TSV under Reliability Stress Conditions King-Jien Chui, Mingbin Yu 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ) Woon Leng Loh, Xiangyu Wang, Zhaohui Chen, Mingbin Yu, King-Jien Chui 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
23 Jun 2015 SERC Institute of Microelectronics Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong Applied Physics Reviews