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26 Jun 2024 SERC Institute of Microelectronics Electrical Characterization and Reliability Studies of Nano-TSV (Pending publish) Ya-Ching Tseng, King-Jien Chui, Simon Chun Kiat Goh, Daniel Lau, Hongyu Li, Tran Van Nhat Anh, Haitao Yu, Chin Khang Tew, Gim Guan Chen, Binni Varghese, Calvin Chua Hung Ming 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing (Pending publish) Simon Chun Kiat Goh, Cheemalamarri Hemanth Kumar, Liangxing Hu, Woon Shervonne, Norhanani Jaafar, Yap Lee Khoon Sherry, Ding Huang, Chit Siong Lau, Senthil Kumar Karuppannan, Hongyu Li, Chuan Seng Tan, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics A Precise Wafer Thinning Integration Process for nano-TSV Formation Ya-Ching Tseng, Simon Chun Kiat Goh, Senthilkumar Darshini, Nandini Venkataraman, Arvind Sundaram, Tew Chin Khang, Yoo Jae Ok, King-Jien Chui 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)