Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
26 Jun 2024 | SERC | Institute of Microelectronics | Electrical Characterization and Reliability Studies of Nano-TSV | Ya-Ching Tseng, King-Jien Chui, Simon Chun Kiat Goh, Daniel Lau, Hongyu Li, Tran Van Nhat Anh, Haitao Yu, Chin Khang Tew, Gim Guan Chen, Binni Varghese, Calvin Chua Hung Ming | 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) |
3 Aug 2023 | SERC | Institute of Microelectronics | A Precise Wafer Thinning Integration Process for nano-TSV Formation | Ya-Ching Tseng, Simon Chun Kiat Goh, Senthilkumar Darshini, Nandini Venkataraman, Arvind Sundaram, Tew Chin Khang, Yoo Jae Ok, King-Jien Chui | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |