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Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2026 SERC Institute of Microelectronics Process Development of Two-Stacked Chips with a Backside Embedded Two-Phase Cooling Solution (Pending publish) Xiaowu Zhang, Boon Long Lau, Huicheng Feng, Gongyue Tang, Ming Chinq Jong, Surya Bhattacharya, Vempati Srinivasa Rao, B.S.S. Chandra Rao, Tran Van Nhat Anh 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
24 Feb 2026 SERC Institute of Microelectronics Development and Monitoring of Gold Electroplating Process on 300 mm Wafer Scale: Impacts of Bath Chemistry and Process Parameters (Pending publish) Tran Van Nhat Anh, Meng Tao 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
26 Jun 2025 SERC Institute of Microelectronics Addressing Key Process Challenges in Developing High Aspect Ratio TSVs up to 15 with 1 μm Critical Dimension (Pending publish) Tran Van Nhat Anh, Nandini Venkataraman, Ya-Ching Tseng, Arvind Sundaram, Binni Varghese, Heng Zeng Wei, B.S.S. Chandra Rao 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding Hemanth Kumar Cheemalamarri, Arvind Sundaram, San Sandra, Tran Van Nhat Anh, Bhesetti Chandra Rao, Chen Gim Guan, Yu Haitao, Mani Raju, Luo Ping, Lee Chaeeun, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Cu/Dielectric hybrid bonding among Glass and Si Hemanth Kumar Cheemalamarri, Arvind Sundaram, Tran Van Nhat Anh, Yoo Jae Ok, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications Hemanth Kumar Cheemalamarri, Tran Van Nhat Anh, Chen Gim Guan, Meng Keong Lim, Srinivasa Rao Vempati, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Electrical Characterization and Reliability Studies of Nano-TSV Ya-Ching Tseng, King-Jien Chui, Simon Chun Kiat Goh, Daniel Lau, Hongyu Li, Tran Van Nhat Anh, Haitao Yu, Chin Khang Tew, Gim Guan Chen, Binni Varghese, Calvin Chua Hung Ming 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)