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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Mar 2026 SERC Institute of Microelectronics Flip chip interconnects for quantum computing application: a comparison between tin-silver and indium bump Norhanani Binte Jaafar, Daniel Lau, Hongyu Li, Yong Chyn Ng, Ya-Ching Tseng Quantum Computing, Communication, and Simulation VI
24 Feb 2026 SERC Institute of Microelectronics Rf and Digital Heterogenous Integration on 2.5D Si-Interposer (Pending publish) Leong Ching Wai, Teck Guan Lim, Ser Choong Chong, Yong Chyn Ng, Vempati Srinivasa Rao 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
24 Feb 2026 SERC Institute of Microelectronics 2.5D Cryogenic Packaging for Advanced Quantum Processors Norhanani Binte Jaafar, Li Hongyu, Ya-Ching Tseng, Yong Chyn Ng, Daniel Lau 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer Teck Guan Lim, Lin Zho, Sasi Kumar Tippabhotla, Ji Lin, Jong Ming Chinq, Jiaqi Wu, Tang Gongyue, Eva Wai Leong Ching, Yong Chyn Ng, King Jien Chui, Wei Jia Lu, Chee Heng Goh, Sek Lin Pek, Jun Wei Agnes Loh 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Demonstration of a CMOS-Compatible Superconducting Cryogenic Interposer for Advanced Quantum Processors King-Jien Chui, Hongyu Li, Yong Chyn Ng, Chit Siong Lau, K. E. J. Goh, D. Huang, Ya-Ching Tseng, J. K. Chen, H. Yu, B. N. Jaafar, H. Lin, B. Varghese 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)