Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Comprehensive Study on Thermal Aging and Ball Shear Characterization of SAC-X Solders Norhanani Binte Jaafar, Chong Ser Choong, Sharon Lim Pei Siang, Chai Tai Chong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)