| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Indium-based Flip-chip Interconnect for Cryogenic Packaging | Norhanani Binte Jaafar, Li Hongyu, Chong Ser Choong, Ng Yong Chyn, Ding Huang, Chit Siong Lau, Kuan Eng Johnson Goh, King-Jien Chui | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| 5 Jan 2022 | SERC | Institute of Microelectronics | Comprehensive Study on Thermal Aging and Ball Shear Characterization of SAC-X Solders | Norhanani Binte Jaafar, Chong Ser Choong, Sharon Lim Pei Siang, Chai Tai Chong | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |