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6 Jun 2024
SERC
Institute of Materials Research & Engineering
Nanoironing van der Waals Heterostructures toward Electrically Controlled Quantum Dots
Teymour Talha-Dean,
Yaoju Tarn,
Subhrajit Mukherjee,
John Wellington John,
Ding Huang,
Ivan A. Verzhbitskiy,
Dasari Venkatakrishnarao,
Sarthak Das,
Rainer Lee,
Abhishek Mishra,
Shuhua Wang,
Yee Sin Ang,
Kuan Eng Johnson Goh,
Chit Siong Lau
ACS Applied Materials & Interfaces
18 Mar 2024
SERC
Institute of Microelectronics
Investigation of SnAg Superconductivity as Solder Material for Cryogenic Packaging
(Pending publish)
Yong Chyn Ng,
Hongyu Li,
Norhanani Binte Jaafar,
Rainer Cheow Siong Lee,
Ding Huang,
Chit Siong Lau,
Kuan Eng Johnson Goh,
King-Jien Chui
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing
(Pending publish)
Simon Chun Kiat Goh,
Cheemalamarri Hemanth Kumar,
Liangxing Hu,
Woon Shervonne,
Norhanani Jaafar,
Yap Lee Khoon Sherry,
Ding Huang,
Chit Siong Lau,
Senthil Kumar Karuppannan,
Hongyu Li,
Chuan Seng Tan,
King-Jien Chui
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Indium-based Flip-chip Interconnect for Cryogenic Packaging
Norhanani Binte Jaafar,
Li Hongyu,
Chong Ser Choong,
Ng Yong Chyn,
Ding Huang,
Chit Siong Lau,
Kuan Eng Johnson Goh,
King-Jien Chui
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023
SERC
Institute of Microelectronics
Demonstration of a CMOS-Compatible Superconducting Cryogenic Interposer for Advanced Quantum Processors
King-Jien Chui,
Hongyu Li,
Yong Chyn Ng,
Chit Siong Lau,
K. E. J. Goh,
D. Huang,
Ya-Ching Tseng,
J. K. Chen,
H. Yu,
B. N. Jaafar,
H. Lin,
B. Varghese
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
31 May 2023
SERC
Institute of Materials Research and Engineering
Dielectrics for Two-Dimensional Transition-Metal Dichalcogenide Applications
Chit Siong Lau,
Sarthak Das,
Ivan A. Verzhbitskiy,
Ding Huang,
Yiyu Zhang,
Teymour Talha-Dean,
Wei Fu,
Dasari Venkatakrishnarao,
Kuan Eng Johnson Goh
ACS Nano
6 Apr 2023
SERC
Institute of Materials Research and Engineering
Liquid-Metal-Printed Ultrathin Oxides for Atomically Smooth 2D Material Heterostructures
Yiyu Zhang,
Dasari Venkatakrishnarao,
Michel Bosman,
Wei Fu,
Sarthak Das,
Fabio Bussolotti,
Rainer Lee,
Siew Lang Teo,
Ding Huang,
Ivan Verzhbitskiy,
Zhuojun Jiang,
Zhuoling Jiang,
Jianwei Chai,
Shi Wun Tong,
Zi-En Ooi,
Calvin Pei Yu Wong,
Yee Sin Ang,
Kuan Eng Johnson Goh,
Chit Siong Lau
ACS Nano
1 Mar 2023
SERC
Institute of Materials Research and Engineering
Solvent‐Dependent Growth of Rigid Styrylstilbene Dicarboxylic Acid Microcrystals as Bent Waveguides and Microlasers
Dasari Venkatakrishnarao,
Shunya Hasebe,
Yasunobu Egawa,
Jinal Tapar,
Ramón Paniagua-Domínguez,
Chit Siong Lau,
Hiroshi Yamagishi,
Hayato Tsuji,
Yohei Yamamoto
Advanced Photonics Research
8 Jun 2021
SERC
Institute of Materials Research and Engineering
Isoemissive Photoluminescence from a Quaternary System of Valley-Polarized, Defect-Bound Excitons and Trions in Two-Dimensional Transition Metal Dichalcogenides
Zi-En Ooi,
Jing Yee Chee,
Swee Liang Wong,
Chit Siong Lau,
Kuan Eng Johnson Goh
The Journal of Physical Chemistry C
13 May 2020
SERC
Institute of Materials Research and Engineering
Toward Valley‐Coupled Spin Qubits
Kuan Eng Johnson Goh,
Fabio Bussolotti,
Chit Siong Lau,
Dharmraj Kotekar-Patil,
Zi En Ooi,
Jing Yee Chee
Advanced Quantum Technologies
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