Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
18 Mar 2024 | SERC | Institute of Microelectronics | Indium-based Flip-chip Interconnect for Cryogenic Packaging | Norhanani Binte Jaafar, Li Hongyu, Chong Ser Choong, Ng Yong Chyn, Ding Huang, Chit Siong Lau, Kuan Eng Johnson Goh, King-Jien Chui | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
3 Aug 2023 | SERC | Institute of Microelectronics | CMOS-Compatible Fine Pitch Al-Al Bonding | Hemanth Kumar Cheemalamarri, Binni Varghese, Sharma Jaibir, Li Hongyu, Chandra Rao S S, Navab Singh, Vempati Srinivasa Rao, King-Jien Chui | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |