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Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2026 SERC Institute of Microelectronics Liquid Metal Cooling for High-Power Electronics Driven by Magnetohydrodynamic Effect Huicheng Feng, Bin He, Gongyue Tang, Xiaowu Zhang, Wei Kin Tan 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
17 Jun 2026 SERC Institute of Microelectronics Process Development of Two-Stacked Chips with a Backside Embedded Two-Phase Cooling Solution Xiaowu Zhang, Boon Long Lau, Huicheng Feng, Gongyue Tang, Ming Chinq Jong, Surya Bhattacharya, Vempati Srinivasa Rao, B.S.S. Chandra Rao, Tran Van Nhat Anh 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
24 Feb 2026 SERC Institute of Microelectronics Two-Phase Liquid Cooling With Backside-Embedded Micro-Pin Fins for High-Power Microelectronics Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
24 Feb 2026 SERC Institute of Microelectronics Numerical Investigation of Embedded Micro Pin-Fin Two-Phase Liquid Cooling for Dual-Chip Stacks in HPC and AI Systems Chinmaya Kumar Patra, Anandaroop Bhattacharya, Prasanta Kumar Das, Xiaowu Zhang, Surya Bhattacharya, Vempati Srinivasa Rao 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
12 Nov 2025 SERC Institute of Microelectronics Two-phase Liquid Cooling of Vertically Stacked High-Power Chips with Backside-Embedded Micro-Pin Fins Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong IEEE Transactions on Components, Packaging and Manufacturing Technology
4 Sep 2025 SERC Institute of Microelectronics Investigation of coolant-dependent thermal performance in backside-embedded micro-pin fin arrays for high-power microelectronics cooling Huicheng Feng, Gongyue Tang, Xiaowu Zhang International Journal of Thermal Sciences
26 Jun 2025 SERC Institute of Microelectronics Development of an Embedded 2-Phase Cooling Solution for Two Stacked High-Power Chips in Future HPC HPC and AI Applications Xiaowu Zhang, Huicheng Feng, Gongyue Tang, Boon Long Lau, Ming Chinq Jong, Surya Bhattacharya, Vempati Srinivasa Rao 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Embedded Liquid Cooling of High-Power Microelectronics Using Liquid Metal Huicheng Feng, Bin He, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Keng Yuen Jason Au, Jun Wei Javier Ong, Ming Chinq Jong 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
28 Feb 2024 SERC Institute of Microelectronics Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, Jun Wei Javier Ong, King Jien Chui, Jun LI, Hongying Li, Duc Vinh Le, Jing Lou IEEE Transactions on Components, Packaging and Manufacturing Technology
30 Oct 2023 SERC Institute of High Performance Computing  Hybrid outflow boundary condition for the pseudopotential LBM simulation of flow boiling Jun LI, Duc-Vinh Le, Hongying Li, Xiaowu Zhang, Chang-Wei Kang, Jing Lou International Journal of Thermal Sciences