Feng, H., He, B., Tang, G., Zhang, X., & Tan, W. K. (2026). Liquid Metal Cooling for High-Power Electronics Driven by Magnetohydrodynamic Effect. In (Editor), 2026 IEEE 76th Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc51846.2026.00273
Abstract:
Highly efficient liquid cooling solutions are essential for continued miniaturization of microelectronics. Liquid metals have exceptionally high thermal conductivities, enabling efficient cooling without the need for complex heat transfer enhancement structures. This substantially reduces flow resistance and improves coefficient of performance (COP). Their high electrical conductivity allows flow actuation using a magnetohydrodynamic (MHD) pump, which operates via Lorentz force and contains no moving parts. As a result, MHD pumps are inherently reliable, easily scalable, and highly integrable. This paper presents a liquid metal cooling system driven by an MHD pump. Theoretical models are developed to guide the cooling system design. The analysis shows that extending the magnet thickness enhances the magnetic field more effectively while maintaining a smaller form factor compared to incorporating a yoke. Pump calibration shows that the theoretical model overpredicts the pressure head; corresponding correction factors are obtained to improve accuracy. The flowrate model reveals how the MHD-driving term and channel geometry affect the coolant flow, providing design insights. A test vehicle is fabricated, experimentally evaluated and numerically simulated. Its performance is compared with air cooling and water cooling. The results demonstrate strong cooling capability, achieving a maximum heat dissipation of 198.4 W at a chip temperature of 100°C with a COP of 13,053. Compared with air and water cooling, liquid metal cooling exhibits clearly superior performance. These findings clearly illustrate the advantages and feasibility of MHD-driven liquid metal cooling technology in high-power microelectronic devices. Further studies will focus on the integration with advanced packages.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the Agency for Science, Technology and Research (A*STAR) - Use-Inspired Basic Research Fund
Grant Reference no. : SC24/25-1218UI
This research / project is supported by the Agency for Science, Technology and Research (A*STAR) - Applied Centre of Excellence in Advanced Packaging 3.0
Grant Reference no. : I2101E0008