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17 Jun 2026 SERC Institute of Microelectronics Process Optimization for Chip-to-Wafer Hybrid Bonding Using Inter-Die Gap Fill Integration Approach (Pending publish) Mishra Dileep Kumar, Vasarla Nagendra Sekhar, Sasi Kumar Tippabhotla, Hipona Randy Tupaen, Norhanani Jaafar, B.S.S. Chandra Rao, Daniel Ismael, Xie Ling, Ser Choong Chong, Vempati Srinivasa Rao 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
26 Jun 2025 SERC Institute of Microelectronics Process Development, Challenges, and Strategies for Void-Free Multi-Chip Stacking in Hybrid Bonding Applications Ser Choong Chong, Ling Xie, Vasarla Nagendra Sekhar, Mishra Dileep Kumar, B.S.S. Chandra Rao, Vempati Srinivasa Rao 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2025 SERC Institute of Microelectronics Thermal Characterization of HBMs Integrated via Hybrid Bonding Huicheng Feng, Yong Han, Gongyue Tang, Ling Xie, Vasarla Nagendra Sekhar 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking Mishra Dileep Kumar, Vasarla Nagendra Sekhar, B.S.S. Chandra Rao, Ser Choong Chong, Vempati Srinivasa Rao 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Mishra Dileep Kumar, Vempati Srinivasa Rao 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding Vasarla Nagendra Sekhar, Mishra Dileep Kumar, Prayudi Lianto, Ser Choong Chong, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Development of 4 die stack module using Hybrid bonding approach Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Study of C2W Bonding Using Cu Pillar with Side-wall Plated Solder Daniel Ismael Cereno, Sunil Wickramanayaka, Vasarla Nagendra Sekhar, Ling Xie 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Sep 2013 SERC Institute of Microelectronics Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices Jaibir Sharma, Cheng Jin, Ying Ying Lim, Justin See Toh, Sanchitha Fernando, Bangtao Chen, Vasarla Nagendra Sekhar IEEE Transactions on Components, Packaging and Manufacturing Technology