Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
18 Mar 2024 | SERC | Institute of Microelectronics | Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding (Pending publish) | Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Mishra Dileep Kumar, Vempati Srinivasa Rao | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
18 Mar 2024 | SERC | Institute of Microelectronics | Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow (Pending publish) | Jason Au Keng Yuen, Ser Choong Chong, Ismael Cereno Daniel | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
3 Aug 2023 | SERC | Institute of Microelectronics | Development of 4 die stack module using Hybrid bonding approach | Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Vempati Srinivasa Rao | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |