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Publication date Communities Collections Article title Author(s) Journal/Conference
30 May 2017 SERC Institute of Microelectronics Study of C2W Bonding Using Cu Pillar with Side-wall Plated Solder Daniel Ismael Cereno, Sunil Wickramanayaka, Vasarla Nagendra Sekhar, Ling Xie 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Stealth Dicing Challenges for MEMS Wafer Applications Daniel Ismael Cereno, Sunil Wickramanayaka 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Thin-film Magnetic Inductors for Integrated Power Management Jun Yu, Serine Soh, Muthukumaraswamy Annamalai Arasu, King Jien Chui, Wei Yi Lim, Sunil Wickramanayaka, Yew Wing Leong, Huamao Lin 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
23 Jun 2015 SERC Institute of Microelectronics Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong Applied Physics Reviews