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8 Dec 2023
SERC
Institute of Materials Research and Engineering
Next‐Generation Vitrimers Design through Theoretical Understanding and Computational Simulations
Ke Li,
Nam Van Tran,
Yuqing Pan,
Sheng Wang,
Zhicheng Jin,
Guoliang Chen,
Shuzhou Li,
Jianwei Zheng,
Xian Jun Loh,
Zibiao Li
Advanced Science
14 Aug 2023
SERC
Institute of Materials Research and Engineering
Endoproteolysis of Oligopeptide-Based Coacervates for Enzymatic Modeling
Zhicheng Jin,
Chuxuan Ling,
Wonjun Yim,
Yu-Ci Chang,
Tengyu He,
Ke Li,
Jiajing Zhou,
Yong Cheng,
Yi Li,
Justin Yeung,
Ruijia Wang,
Pavla Fajtová,
Lubna Amer,
Hedi Mattoussi,
Anthony J. O’Donoghue,
Jesse V. Jokerst
ACS Nano
7 Feb 2023
SERC
Institute of Materials Research and Engineering
Peptide valence-induced breaks in plasmonic coupling
Yu-Ci Chang,
Zhicheng Jin,
Ke Li,
Jiajing Zhou,
Wonjun Yim,
Justin Yeung,
Yong Cheng,
Maurice Retout,
Matthew N. Creyer,
Pavla Fajtová,
Tengyu He,
Xi Chen,
Anthony J. O’Donoghue,
Jesse V. Jokerst
Chemical Science
21 Nov 2022
SERC
Institute of Materials Research and Engineering
Peptide Amphiphile Mediated Co‐assembly for Nanoplasmonic Sensing
Zhicheng Jin,
Yi Li,
Ke Li,
Jiajing Zhou,
Justin Yeung,
Chuxuan Ling,
Wonjun Yim,
Tengyu He,
Yong Cheng,
Ming Xu,
Matthew N. Creyer,
Yu‐Ci Chang,
Pavla Fajtová,
Maurice Retout,
Baiyan Qi,
Shuzhou Li,
Anthony J. O'Donoghue,
Jesse V. Jokerst
Angewandte Chemie International Edition
8 Nov 2022
SERC
Institute of Materials Research and Engineering
Spacer Matters: All-Peptide-Based Ligand for Promoting Interfacial Proteolysis and Plasmonic Coupling
Zhicheng Jin,
Chuxuan Ling,
Yi Li,
Jiajing Zhou,
Ke Li,
Wonjun Yim,
Justin Yeung,
Yu-Ci Chang,
Tengyu He,
Yong Cheng,
Pavla Fajtová,
Maurice Retout,
Anthony J O’Donoghue,
Jesse V. Jokerst
Nano Letters
1 Sep 2013
SERC
Institute of Microelectronics
Antenna-in-Package Design Based on Wafer-Level Packaging With Through Silicon Via Technology
Cheng Jin,
V.N Sekhar,
Xiaoyue Bao,
Bangtao Chen,
Boyu Zheng,
Rui Li
IEEE Transactions on Components, Packaging and Manufacturing Technology
1 Sep 2013
SERC
Institute of Microelectronics
Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices
Jaibir Sharma,
Cheng Jin,
Ying Ying Lim,
Justin See Toh,
Sanchitha Fernando,
Bangtao Chen,
Vasarla Nagendra Sekhar
IEEE Transactions on Components, Packaging and Manufacturing Technology
1 Sep 2013
SERC
Institute of Microelectronics
Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration
Cheng Jin,
Siong Chiew Ong,
Teck Guan Lim,
Ka Fai Chang,
Soon Wee Ho
IEEE Transactions on Components, Packaging and Manufacturing Technology
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