Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
8 Dec 2023 SERC Institute of Materials Research and Engineering Next‐Generation Vitrimers Design through Theoretical Understanding and Computational Simulations Ke Li, Nam Van Tran, Yuqing Pan, Sheng Wang, Zhicheng Jin, Guoliang Chen, Shuzhou Li, Jianwei Zheng, Xian Jun Loh, Zibiao Li Advanced Science
14 Aug 2023 SERC Institute of Materials Research and Engineering Endoproteolysis of Oligopeptide-Based Coacervates for Enzymatic Modeling Zhicheng Jin, Chuxuan Ling, Wonjun Yim, Yu-Ci Chang, Tengyu He, Ke Li, Jiajing Zhou, Yong Cheng, Yi Li, Justin Yeung, Ruijia Wang, Pavla Fajtová, Lubna Amer, Hedi Mattoussi, Anthony J. O’Donoghue, Jesse V. Jokerst ACS Nano
7 Feb 2023 SERC Institute of Materials Research and Engineering Peptide valence-induced breaks in plasmonic coupling Yu-Ci Chang, Zhicheng Jin, Ke Li, Jiajing Zhou, Wonjun Yim, Justin Yeung, Yong Cheng, Maurice Retout, Matthew N. Creyer, Pavla Fajtová, Tengyu He, Xi Chen, Anthony J. O’Donoghue, Jesse V. Jokerst Chemical Science
21 Nov 2022 SERC Institute of Materials Research and Engineering Peptide Amphiphile Mediated Co‐assembly for Nanoplasmonic Sensing Zhicheng Jin, Yi Li, Ke Li, Jiajing Zhou, Justin Yeung, Chuxuan Ling, Wonjun Yim, Tengyu He, Yong Cheng, Ming Xu, Matthew N. Creyer, Yu‐Ci Chang, Pavla Fajtová, Maurice Retout, Baiyan Qi, Shuzhou Li, Anthony J. O'Donoghue, Jesse V. Jokerst Angewandte Chemie International Edition
8 Nov 2022 SERC Institute of Materials Research and Engineering Spacer Matters: All-Peptide-Based Ligand for Promoting Interfacial Proteolysis and Plasmonic Coupling Zhicheng Jin, Chuxuan Ling, Yi Li, Jiajing Zhou, Ke Li, Wonjun Yim, Justin Yeung, Yu-Ci Chang, Tengyu He, Yong Cheng, Pavla Fajtová, Maurice Retout, Anthony J O’Donoghue, Jesse V. Jokerst Nano Letters
1 Sep 2013 SERC Institute of Microelectronics Antenna-in-Package Design Based on Wafer-Level Packaging With Through Silicon Via Technology Cheng Jin, V.N Sekhar, Xiaoyue Bao, Bangtao Chen, Boyu Zheng, Rui Li IEEE Transactions on Components, Packaging and Manufacturing Technology
1 Sep 2013 SERC Institute of Microelectronics Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices Jaibir Sharma, Cheng Jin, Ying Ying Lim, Justin See Toh, Sanchitha Fernando, Bangtao Chen, Vasarla Nagendra Sekhar IEEE Transactions on Components, Packaging and Manufacturing Technology
1 Sep 2013 SERC Institute of Microelectronics Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration Cheng Jin, Siong Chiew Ong, Teck Guan Lim, Ka Fai Chang, Soon Wee Ho IEEE Transactions on Components, Packaging and Manufacturing Technology