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Publication date Communities Collections Article title Author(s) Journal/Conference
12 Nov 2021 SERC Institute of Microelectronics SC0.15Al0.85N-based 4 GHz Coupled Bulk Acoustic Resonators (CBAR) and Filters for the Single-Chip Duplexer Solution Chen Liu, Yao Zhu, Bangtao Chen, Nan Wang 2021 IEEE International Ultrasonics Symposium (IUS)
1 Jun 2019 SERC Institute of Microelectronics Over 10% of k2eff Demonstrated by 2-GHz Spurious Mode-Free Sc0.12Al0.88N Laterally Coupled Alternating Thickness Mode Resonators Nan Wang, Yao Zhu, Geng Li Chua, Bangtao Chen, Srinivas Merugu, Navab Singh, Yuandong Gu IEEE Electron Device Letters
1 Sep 2013 SERC Institute of Microelectronics Antenna-in-Package Design Based on Wafer-Level Packaging With Through Silicon Via Technology Cheng Jin, V.N Sekhar, Xiaoyue Bao, Bangtao Chen, Boyu Zheng, Rui Li IEEE Transactions on Components, Packaging and Manufacturing Technology
1 Sep 2013 SERC Institute of Microelectronics Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices Jaibir Sharma, Cheng Jin, Ying Ying Lim, Justin See Toh, Sanchitha Fernando, Bangtao Chen, Vasarla Nagendra Sekhar IEEE Transactions on Components, Packaging and Manufacturing Technology