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Publication date Communities Collections Article title Author(s) Journal/Conference
26 Jun 2024 SERC Institute of Microelectronics Embedded Liquid Cooling of High-Power Microelectronics Using Liquid Metal Huicheng Feng, Bin He, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Keng Yuen Jason Au, Jun Wei Javier Ong, Ming Chinq Jong 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Mishra Dileep Kumar, Vempati Srinivasa Rao 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Wafer Level Fabrication of Embedded Silicon Microcooler on Heating Devices Lau Boon Long, Javier Ong, Jason Au, Jong Ming Chinq, Zhang Xiaowu, Feng Huicheng 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow Jason Au Keng Yuen, Ser Choong Chong, Ismael Cereno Daniel 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
28 Feb 2024 SERC Institute of Microelectronics Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, Jun Wei Javier Ong, King Jien Chui, Jun LI, Hongying Li, Duc Vinh Le, Jing Lou IEEE Transactions on Components, Packaging and Manufacturing Technology
3 Aug 2023 SERC Institute of Microelectronics Development of 4 die stack module using Hybrid bonding approach Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, King Jien Chui, Jing Lou, Hongying Li, Duc Vinh Le 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)