| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Wafer Level Fabrication of Embedded Silicon Microcooler on Heating Devices | Lau Boon Long, Javier Ong, Jason Au, Jong Ming Chinq, Zhang Xiaowu, Feng Huicheng | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |