Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
10 Aug 2021 | SERC | Institute of Microelectronics | Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio | Ser Choong Chong, Simon Siak Boon Lim, Wen Wei Seit, Tai Chong Chai, Debbie Claire Sanchez | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
18 Mar 2020 | SERC | Institute of Materials Research and Engineering | Electrodeposited Copper Micropillar Surfaces with Pulse Reverse Voltammetry for Enhanced Heat Dissipation | Jayce J. W. Cheng, Fengxia Wei, Sing Yang Chiam | ACS Applied Electronic Materials |
13 Dec 2018 | SERC | Institute of High Performance Computing | Multiscale Models for Electroplating of Through Silicon Vias | K. H. Khoo, MingRui Lai, H. Ramanarayan, Hongmei Jin, S. Wu, C. A. Joshi, K. R. Mangipudi, J. J. Cheng, S. S. Quek, D. T. Wu, N. Sridhar, M. S. Bharathi | 2018 International Wafer Level Packaging Conference (IWLPC) |