Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
13 Dec 2018 | SERC | Institute of High Performance Computing | Multiscale Models for Electroplating of Through Silicon Vias | K. H. Khoo, MingRui Lai, H. Ramanarayan, Hongmei Jin, S. Wu, C. A. Joshi, K. R. Mangipudi, J. J. Cheng, S. S. Quek, D. T. Wu, N. Sridhar, M. S. Bharathi | 2018 International Wafer Level Packaging Conference (IWLPC) |
9 Jun 2017 | SERC | Institute of Materials Research and Engineering | Liquid-metal-based metasurface for terahertz absorption material: frequency agile and wide-angle | Q. H. Song, W. M. Zhu, P. C. Wu, W. Zhang, Q. Y. S. Wu, J. H. Teng, Z. X. Shen, P. H. J. Chong, Q. X. Liang, Z. C. Yang, D. P. Tsai, T. Bourouina, Y. Leprince-Wang, A. Q. Liu | APL Materials |