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13 Oct 2023 SERC Institute of High Performance Computing  Machine learning moment tensor potential for modeling dislocation and fracture in L10−TiAl and D019−Ti3⁢Al alloys Ji Qi, Z. H. Aitken, Qingxiang Pei, Anne Marie Z. Tan, Yunxing Zuo, M. H. Jhon, S. S. Quek, T. Wen, Zhaoxuan Wu, Shyue Ping Ong Physical Review Materials
28 Nov 2019 SERC Institute of High Performance Computing  Defect-Free Electroplating of High Aspect Ratio Through Silicon Vias: Role of Size and Aspect Ratio C. A. Joshi, H. Ramanarayan, K. H. Khoo, H. Jin, S. S. Quek, D. T. Wu, N. Sridhar, M. S. Bharathi 2019 International Wafer Level Packaging Conference (IWLPC)
13 Dec 2018 SERC Institute of High Performance Computing  Multiscale Models for Electroplating of Through Silicon Vias K. H. Khoo, MingRui Lai, H. Ramanarayan, Hongmei Jin, S. Wu, C. A. Joshi, K. R. Mangipudi, J. J. Cheng, S. S. Quek, D. T. Wu, N. Sridhar, M. S. Bharathi 2018 International Wafer Level Packaging Conference (IWLPC)